Today, TSMC  is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric  advanced packaging and chip stacking technologies atits 2021 Technology Symposium. Taking place online for a second year, the symposium connects customers with TSMC’s new offerings, including N6RF for next-generation 5G smartphone and WiFi 6/6e performance, N5A for state-of-the-art automotive ...

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