MIT puts ICs and a network inside a sewable fibre

Researchers at MIT have made a fibre containing integrated circuits and a wired network that can be sewn into fabrics and survive at least 10 washing cycles. “When you put it into a shirt, you can’t feel it at all. You wouldn’t know it was there,” said to professor Yoel Fink. To create the fibre, MIT ...

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Bosch opens fab

Bosch opened its €1bn 65nm 300mm Dresden fab this afternoon – six months earlier than originally planned – and the biggest single investment in Bosch’s 135-year history. Although Bosch is the world’s sixth largest producer of auto chips, the fab will not immediately be contributing to the shortage of auto chips. “The first chips will ...

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Another step on the road to graphene mass production

Graphene can be grown on all sorts of substrates using chemical vapour deposition, but it is riddled with defects and cannot easily be removed for further processing. Growth it on liquid catalyst shows promise, as the liquid surface is naturally flat, and devoid of crystal structure that can encourage periodic defects in the graphene. Furthermore, ...

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NHN adopts Graphcore IPU-PODs

Korean cloud service provider NHN is to use Graphcore IPU-PODs in upcoming AI compute projects, citing  advantages over GPU-based systems. NHN highlighted the scalable design of the IPU-POD, including the separation of AI accelerators and servers, allowing highly flexible configurations. It contrasted this capability with GPU-based systems, where the two elements are packaged together in ...

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IEDM Call for Papers

Under the theme “Devices for a New Era of Electronics: From 2D Materials to 3D Architectures,” the 67th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development. The 2021 IEDM is being planned as an in-person conference ...

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Banner year for OSATS

The  top OSATs (Outsourced Semiconductor Assembly and Test) saw 15-20% increase in 2020 revenue compared to 2019 and 2021 is expected to shape up as a “Banner Year” for OSATs, says Yole Developpement. Advanced packaging revenue is expected to grow at 7.9% CAGR between 2020 and 2026. The FCCSP (Flip Chip Chip Scale Package) market ...

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InP lasers integrated into Imec photonics process

Imec,  Sivers Photonics and ASM AMICRA Microtechnologies have fabricated wafer-scale integration of InP distributed feedback (DFB) lasers from Sivers’ InP100 platform onto Imec’s silicon photonics platform (iSiPP). Using ASM AMICRA’s latest NANO flip-chip bonder tool, the InP DFB laser diodes were bonded onto a 300mm silicon photonics wafer with an alignment precision within 500nm, enabling ...

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Digi-Key supplies Startups Survival Guide

Digi-Key Electronics is launching a microsite and help manual – a Startups Survival Guide – dedicated to helping startups become established. The startup site contains resources, tools and knowledge Digi-Key has built from its own experience of working with thousands of startups. The manual, called the Startups Survival Guide, is the second edition based on ...

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Smallest acoustic amplifier made by Sandia Labs

Sandia National Laboratories’ researchers have built the world’s smallest acoustic amplifier.   Amplifiers can potentially be made smaller and better as acoustic devices by using sound waves instead of electrons to process radio signals. Sandia’s acoustic, 276-megahertz amplifier, measuring 0.0008 in.2 (0.5 mm2), demonstrates the potential for making radios smaller through acoustics. To amplify 2 ...

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