A simpler source of THz radiation

Plasmon-coupled semiconductor surface states can down-convert 1550nm optical wavelengths to terahertz frequencies four-orders of magnitude more efficiently than non-linear optical methods, according to UCLA. When a crystal is a semiconductor – p-doped InAs in this case – the ‘surface states’ created by the left-over bonds that are inevitable at the surface of a crystal lattice ...

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Musk’s Neuralink raises $205m Series C

Elon Musk’s five year-old implanted brain chip unit, Neuralink, has raised another $205 million of venture capital. Vy Capital of Dubai led the Series C funding round which was also supported by Google Ventures, Valor Equity Partners, Craft Ventures and Founders Fund. Musk has said the first Neuralink product will enable someone with paralysis to use ...

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Q2 shipments of silicon wafers up 12% q-o-q

Q2 silicon wafer area shipments increased 6% to 3,534 million square inches beating the record set in Q1 says  SEMI’s Silicon Manufacturers Group (SMG). Q2 2021 silicon wafer shipments grew 12% from the 3,152 million square inches recorded during the same quarter last year. “Demand for silicon continues to see strong growth driven by multiple ...

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Micron shipping 176-layer 512GB UFS mobile NAND

Micron has begun volume shipments of  a 176-layer NAND UF 3.1 mobile memory in 128GB. 256GB and 512GB densities, Engineered for high-end and flagship phones, Micron’s discrete UFS 3.1 mobile NAND unlocks 5G’s potential with up to 75% faster sequential write and random read performance than prior generations, enabling downloads of two-hour 4K movies in as little as 9.6 ...

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Single chip synchronisation for 5G radio access equipment

Microchip has announced its first single chip frequency synchroniser for 5G packet switching, which needs ten times more accurately than 4G networks, it said. “Our ZL3073x/63x/64x network synchronisation platform implements measure, calibrate and tune capabilities, significantly reducing network equipment time error to meet the most stringent 5G requirements,” said the company’s v-p of timing components Rami ...

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Eval board for FTDI USB Power Delivery ICs

FTDI Chip has now announced a development board for USB Power Delivery, centred around its FT4233HP multi-channel interface ICs. The 138 x 77mm board has a pair of Type-C power delivery ports – one that can both sink (receive) and source (provide) power, and another that can only sink power. “The FT4233HP high-speed USB serial and ...

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Power bipolars in DPAK

It is not often you see a new bipolar transistor introduced, and Nexperia has just revealed not just one, but nine of them. All in surface-mount DPAK (TO-252, SOT428C) packaging, they are intended for automotive (in AEC-Q101 qualified form) and industrial applications, and fill out the company’s MJD to span 2 – 8A and 45 – ...

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28V-capable MCU includes USB Power Delivery 3.1

Infineon has introduced a high-voltage microcontroller with USB Power Delivery 3.1 support, claiming it to be an industry first. Branded EZ-PD PMG1-S3, it can be fed at up to 28V and is aimed at embedded systems consuming up to 140W. “The device supports higher power capabilities defined in the USB PD 3.1 specification and leverages ...

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