Intel and Cellwize hook up for vRAN

Cellwize Wireless Technologies (Cellwize) will enable its CHIME technology on Intel Xeon Scalable processors with built-in AI acceleration and Intel FlexRAN reference software in order to propel deployment of automated AI-driven 5G vRAN networks. As cellular networks progress from RAN to vRAN, implementing a scalable cloud-like architecture in 5G networks is important for operators. “This collaboration ...

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Intel and Qualcomm looking to combine strengths

Intel CEO Pat Gelsinger (pictured left) and Qualcomm CEO-elect Cristiano Amon (pictured right) are looking at areas of co-operation as compute and comms converge. “We are the unquestioned compute leader, and Qualcomm’s the unquestioned comms leader – compute meets comms –  right – a lot of new use cases,” Gelsinger told CNBC, “between these two ...

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Imaging and sensing component market on 14.5% CAGR 2020-26

The global 3D imaging and sensing market is expected to grow to $15 billion in 2026, with a 14.5% CAGR 2020-2026, says Yole Developpement. Mobile & consumer is the main segment representing 46% of the total 3D imaging and sensing market in 2026. It is followed by the automotive and industrial segments, which will both ...

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Digi-Key launches myLists consolidated list management system

Digi-Key Electronics has launched a way – dubbed myLists – to make it easier for customers to manage their component sourcing lists in one place. The idea is to streamline customers’ BOM management, price and availability checking and repeat favorites into one system. The tool also includes an attrition calculator to plan for overages that ...

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512Mb NOR flash supports 166MHz SPI clocks.

Winbond has added to its SPI NOR Flash portfolio with a monolithic 1.8V 512Mb SPI NOR flash that can support up to 166 MHz standard/dual/quad SPI clocks. Apart from the existing 3V 512Mb W25Q512JV, the new 1.8V W25Q512NW SPI NOR Flash also features pin-to-pin compatibility, enabling customers to upgrade to higher flash storage capacities without having ...

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A better PEEK

Glasgow University researchers have used 3D printing to  add new properties to polyether ether ketone (PEEK) which result in lightweight, impact-resistant plastic-based ‘honeycomb’ structures which can sense when they have been damaged. PEEK’s mechanical properties and resistance to high temperatures and chemicals have made it useful for a wide range of applications in the aerospace, ...

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