The  top OSATs (Outsourced Semiconductor Assembly and Test) saw 15-20% increase in 2020 revenue compared to 2019 and 2021 is expected to shape up as a “Banner Year” for OSATs, says Yole Developpement. Advanced packaging revenue is expected to grow at 7.9% CAGR between 2020 and 2026. The FCCSP (Flip Chip Chip Scale Package) market ...

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