Techsil is stocking SilCool TIA241GF silicone thermally conductive gap filler from Momentive, intended for applications where good heat transfer, low stress and good interface wetting are required. Thermal conductivity is 4.1W/mK. Called SilCool TIA241GF, it offers tacky adhesion and retained softness after cure for applications where movements in x, y, and z directions occur due to ...

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