Google shuffles Beta timeline for Android 11 release

Google is altering the timeline towards the next major release of its mobile and embedded operating system, Android 11. The end-point remains the same, however, with the full release still scheduled for “Q3”. Basically, it is now releasing an extra Developer Preview – the fourth – for developers to test and provide feedback, and pushing ...

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Raytheon Technologies adjusts to financial impact of Covid-19

Raytheon Technologies, the aerospace and defense specialist, has published its Q1 financial results, claiming solid results in the face of the Covid-19 pandemic. It reported net sales of $18.2 billion, down one per cent year-on-year. Net income in the quarter was a loss of $83 million, down 106 percent versus the prior year and included $1.6 ...

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April fall for TSMC

TSMC’s April  revenues were down  15.4% sequentially to $3.21 billion which was 28.5% up on April 2019. The company’s cumulative, January-April,  revenue is up 38.6% ay $13.4 billion. TSMC expects Q2 revenue of between $10.1 and $10.4 billion and 2020 full year revenue growth of 14-19%. TSMC expects the non-memory semiconductor market to be flat ...

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Bonanza year ahead for Chromebooks

The notebook computer industry will be transformed in 2Q20, with Chromebooks showing the most remarkable growth., says TrendForce. Chromebook shipments in 2Q20 will reach up to 11.6 million units, a historical high in single-quarter shipment. Furthermore, 2Q20 marks the first time ever for Chromebooks to occupy 25% of total quarterly notebook shipment. TrendForce considers the explosive ...

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Intel and Tile to add tracking to laptops

Tile and  Intel are combining to bring tracking technology to laptops. The capability to find a missing laptop will be in commercial products either late this year or early next. Tile trackers use BLE to locate a laptop. If the laptop is  out of  Bluetooth range,  the device  notifies you when your device has been ...

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Liquid cooled lid for thermal management unit

Smiths Interconnect, the manufacturer of IC Test Solutions for the semiconductor test industry, has announced enhancements to its Thermal Management Solutions product offering. Utilising state-of-the-art system simulation models allows the company to optimize each lid’s design for efficient heat dissipation through a variety of cooling mechanisms. Traditional solutions including finned and liquid cooled heatsinks have ...

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