Gap-filling thermal compound has glass bead option

Techsil is stocking SilCool TIA241GF silicone thermally conductive gap filler from Momentive, intended for applications where good heat transfer, low stress and good interface wetting are required. Thermal conductivity is 4.1W/mK. Called SilCool TIA241GF, it offers tacky adhesion and retained softness after cure for applications where movements in x, y, and z directions occur due to ...

This story continues at Gap-filling thermal compound has glass bead option

Or just read more coverage at Electronics Weekly

Sponsored Content: Cloud Services Provide a Path to Embedded Security

Cliff Ortmeyer, Global Head of Technical Marketing at Farnell, considers the use of  cloud Services as a way to provide long-term security and protect the network. Internet connectivity provides the means to add huge value to embedded systems, yet that same connectivity can be a threat to the integrity of devices and the IoT applications that are ...

This story continues at Sponsored Content: Cloud Services Provide a Path to Embedded Security

Or just read more coverage at Electronics Weekly

Testing kit for 1200V CoolSIC MOSFET

Infineon has brought out an evaluation kit for double pulse testing of the switching behaviour of powerdrive options for the 1200V CoolSiC MOSFET in TO247 3-pin and 4-pin packages. The kit comprises a motherboard with interchangeable drive cards. The drive options include a Miller clamp and a bipolar supply card; additional variants will be launched in ...

This story continues at Testing kit for 1200V CoolSIC MOSFET

Or just read more coverage at Electronics Weekly

Farnell signs Sorensen

Farnell has added Sorensen, the DC programmable power supply brand from Ametek, to its range of power supplies. Sorensen designs and manufactures precision, programmable power supplies for research and design, test and measurement, process control, power bus simulation and power conditioning applications across a wide array of industrial segments. Its portfolio comprises of benchtop, modular ...

This story continues at Farnell signs Sorensen

Or just read more coverage at Electronics Weekly

Sponsored Content: IoT-AdvantEdge™ Simplifies IoT Edge Product Design

The path to machine learning and personalization requires that some computing occur at the edge of the network. In fact, Gartner is forecasting that companies will generate up to 75 percent of their data outside a traditional data center within the next six years.1 Privacy is one big reason for the need for edge computing. ...

This story continues at Sponsored Content: IoT-AdvantEdge™ Simplifies IoT Edge Product Design

Or just read more coverage at Electronics Weekly

Arrow, ST and Panasonic combine on IoT edge-intelligence module

Arrow, Panasonic, and ST have introduced a low-power wireless multi-sensor edge-intelligence module for smart factory, smart home, and smart life applications. The IoT Solution Module combines Arrow’s engineering and global distribution capabilities with Panasonic Industry’s IoT modules based on the ST BlueTile (STEVAL-BCN002V1B) multi-sensor development kit. This combination enables customers to test their ideas easily ...

This story continues at Arrow, ST and Panasonic combine on IoT edge-intelligence module

Or just read more coverage at Electronics Weekly

20nm space-grade FPGA

Xilinx has announced a 20nm space-grade FPGA, delivering full radiation tolerance and ultra-high throughput and bandwidth performance for satellite and space applications. The Kintex UltraScale XQRKU060 FPGA provides on-orbit reconfiguration with radiation tolerance across all orbits. A portfolio of ML development tools supporting industry standard frameworks, including TensorFlow and PyTorch, enable neural network inference acceleration ...

This story continues at 20nm space-grade FPGA

Or just read more coverage at Electronics Weekly

Board for enhanced reliability applications

Sundance Multiprocessor has launched  an Intel-based 3U OpenVPX single board computer (SBC) for enhanced reliability industrial control, automotive, mil/aero and UltraHD video and graphics processing applications. Available in standard air-cooled and rugged conduction-cooled versions, the VF370 utilizes the Intel Atom E3900 Series of embedded processors combined with Intel’s Cyclone FPGA technology. The VF370 features a ...

This story continues at Board for enhanced reliability applications

Or just read more coverage at Electronics Weekly

Compact linear LED driver

ROHM has brought out a  compact linear LED Driver suitable for automotive socket type LED lamp applications such as rear lamps, turn, fog and position lamps or DRLs (Daylight Running Lamps). In response to the growing demand for higher levels of reliability, safety, and increased flexibility for the LED’s thermal management in combination with an ...

This story continues at Compact linear LED driver

Or just read more coverage at Electronics Weekly