MicroEJ has standard virtualisation tech for Microchip MCUs

MicroEJ has available standard virtualization technology for Microchip Technology’s 32-bit MCU product line. MICROEJ VEE, MicroEJ’s flagship Virtual Execution Environment, embraces the Total System Solutions vision shared by both companies, enabling a profitable, market ready solution for MCUs and software integration. Thanks to this combined solution, smart device manufacturers can achieve important system design cost ...

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Nanotube’s cut thermal resistance of heatsink interface

Fujitsu Laboratories has created a thin flexible adhesive sheet thermal interface material for heatsinking that achieves up to 100W/mK thermal conductivity. “Unlike previous technologies, the carbon nanotube adhesive sheets are also flexible, making them easy to cut and handle for use on variety of surfaces,” according to the lab. “This technology promises to deliver practical improvements and ...

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Flat Apple

For calendar Q1 (FY Q2) Apple had $58.3 billion revenues for a net profit of $11.2 billion compared to revenue of $58.0 billion and a net profit of $11.6 billion in calendar Q1 2019. “Despite COVID-19’s unprecedented global impact, we’re proud to report that Apple grew for the quarter, driven by an all-time record in ...

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Capacitors endure 150°C for 1000 hours

Panasonic have introduced a surface-mount type ZF series of Conductive Polymer Hybrid Aluminum Electrolytic Capacitors. Being able to endure high temperatures of 150°C for up to 1.000 hours, the new capacitors benefit from a high withstand voltage of 25V to 63V and a low leakage current of (0.01 CV or 3µA). The nominal capacitance range ...

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650V CoolMOS for auto market

Infineon has added to its CoolMOS family to support the electro-mobility market. These silicon-based, ICs can be used in both the PFC and the DC-DC stage of on-board charger systems and HV-LV DC-DC converters specifically optimized for electric-vehicle applications. The CoolMOS CFD7A is fully compatible with system voltages up to 475 V DC. Higher efficiency ...

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Insight SiP signs TME

Insight SiP,  the developer of miniature RF modules with embedded antennas, using SiP and Antenna-in-Package technology, has signed an international distribution agreement with TME of  Lódź. TME has a worldwide distribution network with particular strength in Poland and Eastern Europe, and is one of the world’s fastest growing electronics distributors. From today, TME can supply ...

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