Grade 0 BLDC motor driver reduces MHEV drive systems

An integrated brushless DC (BLDC) motor driver has been introduced by Texas Instruments, targeting the mild hybrid electric vehicle (MHEV) market. The DRV3255-Q1 is claimed to be the first three-phase 48-V BLDC motor driver to integrate high- and low-side active short-circuit logic. This integration eliminates external transistors and control logic to reduce the size of ...

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Microchip to create Cork development centre

Microchip is investing $20 million  to create a development centre in Cork. The new facility will open during Q1 2021 and create 60 new jobs over the next three years and approximately 200 jobs within the next seven years. “I welcome Microchip Technology’s $20m investment in a new development centre in Cork,” says Taoiseach Micheál ...

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ISSCC 2021: 802.15.4z impulse-radio UWB transmitter IC

Imec showed the first IEEE 802.15.4z impulse-radio ultra-wideband (IR-UWB) transmitter chip at ISSCC. The device strikes a balance between UWB’s accurate and secure ranging capabilities for indoor localization and the need for increased energy efficiency. Fabricated in 28nm CMOS (with an occupied core area of only 0.15mm²), the chip aims to enable the next generation ...

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Harmony in April

Huawei’s consumer boss, Richard Yu, shows off the new flagship foldable Mate X2. Yu says that the smartphone version of  Huawei’s HarmonyOS will be available in April. The X2 has an 8.01-inch display when unfolded, alongside a 6.45-inch screen on the front. The internal display offers minimal glare and an improved reading experience. It uses a ...

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U.S. Space Command battle takes political turn

Could the location of the U.S. Space Command headquarters, which was moving from Colorado to Alabama, be moving back again? Space Command was set to make its new home at the Redstone Arsenal in Huntsville, Alabama, a centre for developing and testing U.S. Army missile programs. It’s currently based at the Peterson Air Force Base ...

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ISSCC 2021: Leti and Dolphin develop adaptive back-bias for FD-SOI

CEA-Leti and Dolphin Design have developed an adaptive back-biasing (ABB) architecture for FD-SOI chips that can be integrated in the digital design flow with industrial-grade qualification, overcoming integration drawbacks of existing ABB techniques. FD-SOI is a technology that allows the biasing of the transistor’s body that acts as a back gate. Unlike conventional bulk technology, ...

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Automotive pressure sensor interface includes 4th-order polynomial correction

Allegro is aiming at automotive bridge-type pressure sensors with an interface IC designed to connect directly to a strain gauge or other Wheatstone bridge sensor. Qualification is automotive AEC-Q100 Grade 0. Called A17700, it amplifies and offset-adjusts the analogue input to best-fill the ADC for its internal digital signal processor. DSP includes filtering to trade speed with ...

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