The government has today published its draft rules of the road for governing the future use of digital identities. It is part of plans to make it quicker and easier for people to verify themselves using modern technology and create a process as trusted as using passports or bank statements. The public are invited to ...

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The combined capacity of the top five companies represented 54% of total global wafer capacity in December 2020, up one point from 53% in 2019, says IC Insights.  For comparison, in the year 2009, the top 10 wafer capacity leaders held 54% of total global capacity and the top five leaders accounted for 36% of ...

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Siemens Digital Industries Software today announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement solutions engineered to help mutual customers create and evaluate multiple complex IC package assemblies and interconnect scenarios. The high-density advanced packaging (HDAP) enablement solutions stem from ASE’s participation in the Siemens OSAT Alliance – a ...

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Imec reports the use,  for the first time, of a 13.5 nm High Harmonic Generation source for the printing of 20nm pitch line/spaces using interference lithographic imaging of an Inpria metal-oxide resist under high-numerical-aperture (high-NA) conditions. The demonstrated high-NA capability of the EUV interference lithography using this EUV source presents an important milestone of the ...

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ULEMCo, the UK hydrogen fuel pioneer, and their partners have delivered the first significant milestone to create the zero emission ambulance of the future. The project, named ZERRO for Zero Emission Rapid Response Operations ambulance, is funded by the Office for Zero Emission Vehicles (OZEV), and aims to deliver a prototype zero emission ambulance for ...

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