LCD driver for 368 segments in vehicle dash

Epson is aiming at vehicle instrument clusters with a greyscale segment LCD driver for up to 368 segments. “The amount of information that needs to be shown on instrumental cluster displays is increasing as vehicles gain additional features and functions,” according to the company. “On the other hand, larger displays with higher definitions increase costs. For this reason, ...

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Arm embedded computer in pico-ITX format

Kontron is launching an Arm-based pico-ITX (100 x 72mm) single board computer built around a 1.5GHz quad core Cortex-A53 processor for demanding graphics applications. Called pITX-iMX8M, the processor is an iMX8M from NXP and it includes drive for 4K UltraHD resolution displays – with optional high dynamic range. Displays can be connected via LVDS Dual Channel, mini display ...

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Private network 5G spending to outpace public network spending, says Nokia CEO

More money will be invested in private 5G networks than in public networks over the next ten years, says Nokia CEO Pekka Lundmark. Lundmark is putting his faith in the ability of 5G to deliver ‘mission critical’ applications. “It all comes back to those two key words: critical networks,” says Lundmark, “as the 5G tech ...

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Building a ‘Space Bridge’ between the UK and Australia

The UK Space Agency calls it a ‘Space Bridge’, between the UK and Australia to form “a partnership to increase knowledge exchange and investment across the two countries’ space sectors”. Announcing the agreement, the UK Science Minister Amanda Solloway said: “The signing of today’s Space Bridge partnership, a world’s first, with one of our closet ...

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ams and ArcSoft demo 3D ToF system for Android devices

ams and imaging software developer ArcSoft have demonstrated a working system for 3D direct Time-of-Flight (dToF) sensing, offering a complete solution for 3D sensing for use in mobile devices for Android. Integrating ams’ 3D optical sensing solutions and ArcSoft’s middleware and software for simultaneous localisation and mapping (SLAM) and 3D image processing offers the option for manufacturers to ...

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Nexperia launches compact half-bridge auto MOSFETs

Nexperia has brought out a series of half-bridge (high side & low side) automotive MOSFETs constructed in the space-saving LFPAK56D package format. The half-bridge configuration of two MOSFETS is a standard building block for many automotive applications including motor drives and DC/DC converters. The new package provides a half-bridge solution in one device, occupying 30% ...

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Murata inertial sensor has six degrees of freedom for industrial equipment

Murata has announced an inertial sensor for adding navigation to industrial equipment, even in environments where there is high mechanical shock and vibration. The six-degrees-of-freedom sensor is called SCHA63T and includes X, Y and Z-axis angular rate sensors and a three-axis accelerometer based on capacitive MEMS. Signal processing is done with two mixed signal ASICs that ...

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Precision chip resistors are automotive qualified.

KOA’s RN73R series chip resistors are compliant with the AEC-Q200 automotive standard, can operate over -55°C to +155°C (derated above 85°C) and have a thin film element of with temperature coefficient from ±5ppm to ±100ppm. “The series has a far greater electrolytic corrosion resistance than its predecessor – the RN73 series – which ensures a ...

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Xilinx launches SmartNICs and video analytics to accelerate data centres

To accelerate the work rate of data centres, Xilinx has introduced a suite of products to address networking functions and AI analytics. The company announced a new family of Aleveo SmartNICs, AI video analytics applications and an accelerated algorithm trading reference design for fast (sub-microsecond) trading. The company also launched the Xilinx App store today. ...

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Europrocessor design to be implemented in Bangalore

Bangalore design house Open Silicon Research will put SiPearl’s Europrocessor, called Rhea, into silicon for TSMC’s 6nm process. The Arm-based Rhea is built for HPC applications and provides  improvements in memory bandwidth enabled by Open-Silicon Research’s High Bandwidth Memory (HBM2E) IP subsystem, die-to-die (D2D) interconnect, and HBM memory die into a single 2.5D advanced package. ...

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