Samsung has launched ‘Flashbolt’, its third-generation High Bandwidth Memory 2E (HBM2E). The 16GB HBM2E is suited to HPC systems. The 16GB capacity is achieved by vertically stacking eight layers of 10nm-class (1y) 16Gb DRAM die on top of a buffer chip. Flashbolt has a data transfer speed of 3.2Gbps a memory bandwidth of 410GB/s per stack. ...
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After the merger of Qorvo and Dublin fabless location specialist Decawave, the two companies aim to: . Continue to contribute to the IEEE, Car Connectivity Consortium, FiRa and UWB alliance to define next generation PHYs and protocols, ensuring interoperability across applications and fueling IR-UWB adoption, . Accelerate the roadmap of ICs and modules, leveraging their ...
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Leti has developed a silicon nitride (Si3N4) 200mm platform for developing ultralow loss, high-power photonics in UV through mid-infrared wavelengths. Available in CEA-Leti’s SiN platform in a multi-project-wafer program, the breakthrough targets designers in integrated quantum optics, LiDAR, biosensing, and imaging whose projects require ultralow propagation losses and high-power handling capability. This ultralow-loss SiN layer is ...
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NeoPhotonics is sampling Semiconductor Optical Amplifiers (SOAs) and Narrow Linewidth (NLW) Distributed Feedback Lasers (DFB) lasers for LIDAR applications. The lasers have 1550nm wavelength SOAs with >24 dBm (>250mW) output power along with 1550nm NLW-DFB lasers that enable automotive Lidar systems to “see” farther than 200 metres. Chip scale manufacturing requires coherent Photonic Integrated Circuits (PICs) ...
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UltraSoc has appointed Ryoden as its technical representative in Japan to bring its on-chip cybersecurity and embedded analytics architecture to more Japanese electronics manufacturers, particularly those targeting automotive applications. Ryoden will work alongside Intralink, UltraSoC’s existing commercial representative in the country. Ryoden was selected by UltraSoC because of the company’s extensive contacts within the semiconductor ...
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UnitedSiC has introduced what it claims is industry’s lowest Rds(on) 650V SiC FET in a low-profile DFN 8×8 surface-mount package. Called UF3SC065030D8S, its Rds(on) is 34mΩ, and UF3SC065040D8S is a cheaper partner device that achieves 45mΩ. “Both SiC FETs have a current rating of 18A (limited by wire count in the package), and a maximum operating ...
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Electrical engineers at the Tokyo University of Science have created a CMOS chip that implements a quantum annealing processor capable of solving the traveling salesman problem for 22 cities in a second. According to the researchers, a conventional 30Goperation/s, high-performance von Neumann architecture CPU that can solve a 16 city travelling salesman problem in 12 minutes, would require about ...
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Rohm has announced the availability of the BD71850MWV PMIC, optimized for NXP Semiconductors’ i.MX 8M Nano family of application processors. With the BD71837AMWV for i.MX 8M quad and dual applications processors and the BD71847AMWV for i.MX 8M Mini family application processors, Rohm offers power solutions for the entire i.MX 8M series. NXP’s applications processors are ...
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While consolidation in the semiconductor industry contributed to lower growth rates in R&D spending in the past five years, the long-term trend has been for a slowdown in annual increases of research and development expenditures since the 1980s, says IC Insights. However, IC Insights’ McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry, concludes ...
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Imec, Ghent University, Brigade de Sapeurs-Pompiers de Paris, Connect Group and Sioen, have come up with a prototype of protective firefighters’ clothing with integrated temperature sensors and electronics to warn firefighters of too high ambient temperatures. It should significantly reduce the number of injuries to firefighters. “Firefighters are often exposed to extremely high temperatures during ...
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