The Ultimate Arduino Challenge was announced at Embedded World by Arduino co-founder Massimo Banzi. The Ultimate Arduino Challenge is divided into three categories: Data Collection, Industrial IoT, and Anything Goes. The Data Collection category tasks engineers with collecting data using an Arduino board and various sensors; The Industrial IoT contest tests engineers’ skills in designing ...

This story continues at Embedded World: The Ultimate Arduino Challenge

Or just read more coverage at Electronics Weekly

Samsung is ramping up production of its 512GB eUFS 3.0 3D NAND flash memory module. In H2 it plans to launch a 1TB device. Samsung’s 512GB eUFS 3.0 stacks eight of the company’s fifth-generation 512Gb 3D NAND die and integrates a high-performance controller. At 2,100 MB/s,  the new eUFS doubles the sequential read rate of Samsung’s ...

This story continues at Samsung ramps 512GB flash module; launching 1TB in H2

Or just read more coverage at Electronics Weekly

China car manufacturer Geely, Qualcomm and IoT specialist Gosuncn have teamed upto0put  5G-linked cars on the road in China in 2021. proposed its four steps G-Pilot strategy for autonomous driving in 2018. Presently, its autonomous driving is at Level 2 and will now provide Level 3 services with 5G and C-V2X technologies in 2021 for ...

This story continues at Embedded World: Qualcomm and Geely look to 5G-enabled C-V2X

Or just read more coverage at Electronics Weekly

Hua Hong Semiconductor, the China foundry,  is looking to acquire a 14nm process next year. It also  plans to develop 7nm and 5nm processes. Hua Hong says it will add capacity to its fabs in Shanghai (Jinqiao, Zhengjiang and Kangqiao) and Wuxi, to achieve 350,000 wpm capacity next year.. Hua Hong’s first 12-inch fab dubbed ...

This story continues at Hua Hong heads for 5nm

Or just read more coverage at Electronics Weekly

Intel has ended its year-old deal to co-develop 5G modems with the Tsinghua Unigroup-owned wireless chip company Unisoc. Intel says the partnership has not been ended because of pressure from the US government, “We decided mutually that we would not continue the partnership,” said Robert Topol, GM of Intel’s 5G strategy and program office at MWC in ...

This story continues at Intel cans 5G deal with Tsinghua Unigroup

Or just read more coverage at Electronics Weekly

e-peas, the Belgian low-power specialist, is applying its technology to energy harvesting with a chip optimized for energy harvesting from thermal sources in wireless sensors application. Supplied in a 28-pin QFN package, the AEM20940 is capable of extracting available input current up to levels of 110mA. Taking DC power from a connected thermal electric generator ...

This story continues at Embedded World: e-peas addresses thermal energy harvesting

Or just read more coverage at Electronics Weekly