Former Plessey head takes on Cambridge sensor spin-out as CEO

University of Cambridge spin-out Sorex Sensors has appointed Michael LeGoff as CEO – LeGoff founded LED-maker Plessey Semiconductors, and before that Dynex. Sorex raised £1.2 million seed funding last year from Cambridge Enterprise, the Cambridge Angels and Cambridge Capital Group. “The team has done a fantastic job in bringing its sensing technology close to the ...

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Embedded World: Bluetooth chip gets Arm Cortex-M33 to run applications and algorithms

Dialog Semiconductor has included an Arm Cortex-M33 application and algorithm processor in a Bluetooth 5.1 wireless microcontroller, to create a family called DA1469x. “The product family is the first wireless microcontroller in production with a dedicated application processor based on the ARM Cortex-M33 processor,” said Dialog. “The M33 offers developers greater processing power for more ...

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Embedded World: SamacSys announces a new Altium integration

SamacSys, the specialist provider of electronic component CAD models, has completed a new integration with Altium, the supplier of PCB design tools. The agreement was announced at Embedded World in Nuremberg and the collaboration will support Altium customers by directly integrating the SamacSys platform of free design resources, including PCB footprints, schematic symbols and 3D ...

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Embedded World: Trinamic chooses Risc-V for intelligent motor driver chip

German chip firm Trinamic has chosen Risc-V over Arm for the processor inside its latest generation of motor drivers – it specialises in drivers with advanced features, aimed at high-performance positioning systems like servos and those in computer controlled machines. Dubbed Rocinante (named from both Don Quixote and The Expanse, according to the firm), it ...

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Toshiba launches 31 single-supply single gate logic ICs

Toshiba has announced a range of single-supply single-gate logic devices. In total the line-up consists of 31 devices that simplify the design of voltage-level translation as used in data communication between devices, such as between microprocessors and peripherals. These single-gate devices are provided in tiny packaging that ensure that voltage translation can be implemented even ...

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Embedded World: TI launches BAW ICs

TI has announced  bulk acoustic wave (BAW)-based embedded processing and analogue chips for connectivity and communications infrastructure. The first two devices developed with TI BAW technology are the SimpleLinkTM CC2652RB wireless microcontroller (MCU) and the LMK05318 network synchronizer clock. BAW resonator technology integrates reference clocking resonators which improves performance and increases resistance to mechanical stresses, ...

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Imec on Augmented Reality

This is the seventh in a series of essays from Imec on the future of electronics technology. It is called Augmented Reality and it is by Imec principal scientist Soeren Steudel AR glasses have the potential to replace the smartphone within 10-15 years from now, says Soeren Steudel, who heads up the displays research activity at Imec. ...

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Call for cyber security innovators

The London Office for Rapid Cybersecurity Advancement (LORCA) today launches the open call for its third group of cyber innovators. The new group will be tasked with solving some of the most pressing cybersecurity issues, as identified by industry leaders at LORCA’s Innovation Forum. Details of the application process and a full description of the challenges can be ...

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Micron launches SSD using 96 layer 3D NAND

Micron’s  1300 SATA SSD uses 96-layer TLC 3D NAND-based SSDs and delivers storage capacities up to 1TB (in M.2) and 2TB (in 2.5-inch).  It delivers sequential reads/writes up to 530MB/520MB per second and random reads/writes up to 90,000/87,000 input/output operations per second (IOPS). It uses 75 mW. Itbsupports Microsoft Windows 10 Modern Standby requirements including adaptive thermal management ...

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