CUI has announced a couple of encapsulated ac-dc PSUs with multiple mounting options – 3W and 5W models. The single output PSK‑S3 types are housed in packges down to 37 x 24.5 x 18mm, and PSK‑S5B is the other type. PSK‑S3‑L and PSK‑S5B‑L have wire leads PSK‑S3‑T and PSK‑S5B‑T chassis mount PSK‑S3‑DIN and PSK‑S5B‑DIN mount ...
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TDK has introduced the DRM40 series of DIN rail mount redundancy modules. Two 10V to 30Vdc inputs are rated at 20A each and the output at 40A. 150% peak load is available for four seconds for capacitive and inductive loading, and the internal (reverse current protection) mosfets have a 200mV drop, reducing power losses in ...
This story continues at 20 – 40A DIN rail redundancy module shares load between two PSUs
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This is a sad day at Electronics Weekly, as we just learned that our former editor Richard Wilson died over the weekend, with his family alongside, after a long illness. I can’t say enough nice things about Richard. At work, he was incredibly hard-working, wise, effortlessly intelligent and dedicated to keeping Electronics Weekly on an ...
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In the hunt for programmers, Pico Technology has opened a software office in Manchester. “Pico is growing faster than we can recruit software engineers at our head office in St Neots, so today sees the opening of an additional software development office in Manchester,” said MD Alan Tong. The firm makes its scopes, which use ...
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Imec and EnergyVille have a new simulation framework that can accurately calculate the energy yield of bifacial PV systems (also capturing reflected light from the ground). The high precision of the new simulation framework compared to existing approaches comes from the fact that the framework not only computes the energy yield of the individual cells ...
This story continues at Imec simulation tool calculates energy yield of bifacial PV systems
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18 out of the 30 EUV machines which ASML will ship this year will go to TSMC, reports Digitimes. At the end of March, TSMC is expected to begin volume production of a version of its 7nm process which uses EUV. It first started volume production on 7nm using immersion lithography in April 2018. This ...
This story continues at TSMC to start 7nm on EUV next month
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Jedec’s new wide bandgap committee has issued its first standards paper – JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices. JEP173 covers GaN power FETs, providing a method for the consistent measurement of drain-to-source resistance in the ON-state (RDS(ON)) encompassing dynamic effects. These dynamic effects are characteristic of GaN power FETs, ...
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Three year-old autonomous delivery van start-up Nuro of New Jersey has received a $940 million investment from The Vision Fund. Nero, which was founded by two Waymo engineers, has now raised $1 billion. SoftBank’s investment was made at a company valuation of $2.7 billion. Nuro began running a delivery service in San Francisco last year ...
This story continues at Autonomous delivery vehicle start-up raises $940m
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Ericsson and Intel are aligning their development work on Ericsson SDI Manager software and Intel Rack Scale Design (RSD) for Network Functions Virtualization (NFV), distributed cloud, and 5G. ‘This new collaboration will focus on software in addition to hardware and we see it to be truly transformative for service providers’ ability to successfully deploy open ...
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AIStorm of San Jose, which uses analogue processing instead of GPUs for machine learning at the edge, has closed a $13.2 million in Series A financing from Egis Technology, TowerJazz, Meyer Corporation and Linear Dimensions Semiconductor. “This investment will help us accelerate our engineering & go-to-market efforts to bring a new type of machine learning to the ...
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