ISSCC: Transceivers for radar and communication

RF tranceivers for radar and communication were the subject of Session 9 at the ISSCC (see below) this year, with 79GHz devices and on-chip bean-forming featuring strongly. In an invited paper, MediaTek described the technological challenges of developing automotive surround-view radar systems for 360° proximity sensing for vehicles, concentrating on a 79GHz FMCW (frequency-modulated continuous-wave) ...

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RGB UV IR light sensor is under 1x2mm

STMicroelectronics has introduced a multi-spectral ambient light (plus UVA and near-IR) sensor, with flicker detection, in a package smaller than 1mm x 2mm. Applications are foreseen with phone cameras for white-balance, artificial/natural/outdoor light discrimination and flicker frequency measurement – the latter to avoid banding and set exposure time. Called VD6281, it is claimd to be ...

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GloFo and Dolphin combine on ABB IP

GLOBALFOUNDRIES  and Dolphin Integration are to develop a series of adaptive body bias (ABB) IPs to improve the energy efficiency and reliability of  SoCs made on GloFo’s 22nm FD-SOI (22FDX) process. Dolphin and GLoFo are working together to develop a series of off-the-shelf ABB solutions for accelerating and easing body bias implementation on SoC designs. ...

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Hi-rel 40W dc-dc has 1in footprint and 10 year warranty

Cosel has announced a high reliability 40W dc-dc converter,with a 10 year warranty. Called MGF40, it comes in an industry standard 1 x 1inch (~25 x 25mm) six-sided-shielded metallic case and is said to have a failure rate of below 30ppm. “To guarantee lifetime quality, the MGF40 does not include aluminium or tantalum capacitors,” said ...

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Dual 100V mosfet is AEC-Q101 qualified

Toshiba has released a dual n-channel mosfet with high ESD protection, intended for automotive applications including driving headlight LEDs. Made on the firm’s U-MOSⅧ-H process and AEC-Q101 qualified, it is called SSM6N813R. Each transistor in the package has a maximum current of 3.5A (subject to junction temperature) and maximum drain-source voltage of 100V – a ...

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Passive-active antenna to optimise tower space

CommScope is collaborating with Nokia to develop passive-active antenna solutions which enable operators to optimise tower space usage, increase cell site capacity and prepare for 5G. As 5G roll-out starts, 5G MIMO antennas capable of 3.5 GHz frequency bands may need to be deployed,  CommScope and Nokia are developing new passive-active antenna solutions to boost ...

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Imec develops 3.2GSps RF-sampling ADC

Imec has developed a compact, highly linear 3.2 giga-sample-per-second (GSps) RF-sampling ADC that uses ring amplification (ringamp). The ADC has a record low power consumption of 61.3mW and supports multiband operation and massive MIMO implementation – two key features of future 5G base stations. A second power-efficient ringamp-based ADC – reconfigurable between 6 and 600Msps ...

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Adding alkali metal to perovskite solar cells changes the solar game

Researchers from  Georgia Tech, UC San Diego and MIT havr discovered that adding alkali metal to perovskite solar cells could enable energy devices to last longer and maintain better performance. “Perovskites could really change the game in solar,” says David Fenning  of UC San Diego, “they have the potential to reduce costs without giving up ...

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LoraWAN access module

Renesas and Miromico have come up with a module which enables connections to LoRaWAN-based networks. The module, FMLR-61-x-RSS3, uses Renesas’ Synergy Platform, giving access to MCUs and software.  Customers can use the S3A6 MCU on the LoRa-based module to handle various tasks, while streaming data across a LoRaWAN-based network to the cloud.  The LoRaWAN protocol is being ...

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18V process for LCD/OLED drivers

MagnaChip Semiconductor, the Korean mixed-signal vendor, is offering foundry customers its second generation 0.13 micron 18V high voltage process technology. The technology, which is dedicated for designing source drivers for LCD and OLED televisions, offers fewer steps, allows suitable high voltage device design rules to shrink chip size and adds a new device for DAC ...

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