At Embedded World 2019, we caught up with Milan Yudkovich, founder of IoT specialist SensiEDGE, as part of our promotional coverage for the event. He discusses how the company’s devices make it easier and faster for developers and startups to design their IoT applications. Thank you to Milan for his time. Read all our Embedded ...
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At Embedded World 2019, we caught up with Jackie Rutter of Analog Devices, as part of our promotional coverage for the event. She discusses power control and power management, embedded AI, cyber security at the device level, and a wireless smart sensor system for condition-based applications. Thank you to Jackie for her time. Read all ...
This story continues at Embedded World: Video Interview – Analog Devices, on power management and embedded AI
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We caught up with Hussein Osman of Lattice Semiconductor to discusses implementing AI at the network edge.
This story continues at Embedded World: Video Interview – Lattice enables low-power AI at the Edge
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Intel has ended its year-old deal to co-develop 5G modems with the Tsinghua Unigroup-owned wireless chip company Unisoc. Intel says the partnership has not been ended because of pressure from the US government, “We decided mutually that we would not continue the partnership,” said Robert Topol, GM of Intel’s 5G strategy and program office at MWC in ...
This story continues at Intel cans 5G deal with Tsinghua Unigroup
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e-peas, the Belgian low-power specialist, is applying its technology to energy harvesting with a chip optimized for energy harvesting from thermal sources in wireless sensors application. Supplied in a 28-pin QFN package, the AEM20940 is capable of extracting available input current up to levels of 110mA. Taking DC power from a connected thermal electric generator ...
This story continues at Embedded World: e-peas addresses thermal energy harvesting
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Clive Couldwell, group editor of Electronics Weekly, anticipates attending Embedded World 2019, running 26-28 February, in Nuremberg. He expects automotive, AI and IoT security to be big themes of the show. And, if you are attending in Germany, he cordially invites you to come and say hello at the stand we share with OEMSecrets, who ...
This story continues at Embedded World 2019 – Video preview
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At Embedded World today, Insight SiP, the specialist in ultra-miniature RF modules, is launching the ISP4520 series of modules, extending its product portfolio to include Long Range Networking via LoRa technology. The ISP4520 module integrates BLE and LoRa radio functionality to offer a unique solution, combining the short-range high throughput capability and easy smartphone/PC access ...
This story continues at Embedded World: Insight SiP adds LoRa
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Today, at Embedded World in Nuremberg, UltraSOC announced that its UltraDevelop 2 IDE is now available for beta testing and is being shipped to qualified lead customers. The new IDE will be publicly demonstrated for the first time at Embedded World. Launched in October 2018, UltraDevelop 2 presents a complete and comprehensive IDE for system-on-chip ...
This story continues at Embedded World: UltraSoC demoes new IDE.
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This is the sixth in a series of essays by Imec on the future of electronics technology. This one is called: Smart Industries. Man and machine collaborating on the factory floor: a nightmare or a match made in heaven? What will our factories look like in 2035? asks Pieter Simoens of the University of Ghent, ...
This story continues at Imec on Smart Industries
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Q4 DRAM revenues fell by 18.3% QoQ, reports DRAMeXchange. ASPs of mainstream 8GB modules have fallen to $50 for January, and will continue to fall through in February and March, says DRAMeXchange, with an estimated decline of 20-25% for Q1. The production bit levels of DRAM suppliers in 4Q18 were far above sales bit levels, ...
This story continues at DRAM takes a tumble
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