Intel, TSMC, Samsung, Qualcomm, ASE, AMD, Arm, Google Cloud, Microsoft and Meta are to pursue a die-to-die interconnect packaging standard  calked Universal Chiplet Interconnect Express (UCIe). Nvidia is not in the consortium, although the members say they are prepared to accept new members. The  UCIe standard is aimed at developing a die-to-die interconnect standard allowing chips ...

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onsemi has sold its South Portland, Maine fab to Diodes following the closure of its Oudenarde, Belgium fab last month. “The proposed divestitures show that we are well on our way to achieve an optimized manufacturing network while supporting our customers with long-term assurance of supply,” says CEO  Hassane El-Khoury, “the transactions provide employees at ...

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Sondrel has come up with a ten step guide to designing an SoC. They are: Break the problem into stages using a divide and conquer methodology? As the level of detail increases at each stage, consider fewer options for exploratiion Focus resources as process progresses Avoid wasted simulation time Reduce data-set to be analysed Reduce ...

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