Ukraine invasion fallout blocks OneWeb satellite launches

OneWeb, the satellite company partly-owned by the UK government, is involved in a Ukraine-related row with the Russian-operated Baikonur spaceport, which has been used for launching its constellation. The board of OneWeb has decided to suspend all launches from Baikonur (which is actually located in Kazakhstan) it has announced, following an apparent ultimatum for the ...

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Graphcore adds WoW to IPU.

By moving its 7nm  IPU to TSMC’s Wafer-on-Wafer technology, Graphcore has increased its performance by up to 40% and its power efficiency by 16%, says the company. WoW stacks two flipped  wafers together, connects them through TSVs and bonds them  before dicing. Graphcore says this is the first commercial use of the technology. In the ...

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800Gbit/s optical demo by AMD and Ranovus

Aiming at data centres, Ranovus and AMD are demonstrating 800Gbit/s optical comms at OFC 2022. The optical interface and its fibres, emerging from under the aluminium block The optical module co-packages Xilinx Versal ACAP (adaptive compute acceleration platform) and Ranovus’ Odin 800Gbit/s ‘CPO 2.0′ module. Odin is a protocol agnostic optical engine build around Ranovus’ 100Gbit/s/λ ...

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Open standard for RISC-V verification is announced at DVCon

At this year’s (virtual) functional design and verification conference, DVCon US 2022, the RISC-V Verification Interface (RVVI) was announced by Imperas Software. The interface is available at github. The draft open standard defines “a number of interfaces required to bring together several of the subsystems required for RISC-V processor design verification”. Components based on the open ...

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Ice Lake-D on COM Express basic type 7

Kontron has adopted Intel Ice Lake-D processors for a COM Express basic type 7 computer-on-modules, and has an evaluation carrier board to go with them. Called COMe-bID7, they will be available with Xeon D-1700 processors scaling from 4 to 10 cores and accommodates up to 4x SO-DIMM sockets for a maximum of 128Gbyte of memory. ...

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Chiplet consortium to develop packaging standard

Intel, TSMC, Samsung, Qualcomm, ASE, AMD, Arm, Google Cloud, Microsoft and Meta are to pursue a die-to-die interconnect packaging standard  calked Universal Chiplet Interconnect Express (UCIe). Nvidia is not in the consortium, although the members say they are prepared to accept new members. The  UCIe standard is aimed at developing a die-to-die interconnect standard allowing chips ...

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IGBTs in enhanced TO247

Formerly only available in modules, Infineon is now putting its EDT2 IGBTs die into individual packaging – its TO247Plus package. The devices are optimised for automotive traction inverters and “exceed AECQ101 for automotive components”, claims the firm. “With the automotive micro-pattern trench-field-stop cell design, the IGBTs are based on technology that has already been utilised ...

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Onsemi sells two fabs

onsemi has sold its South Portland, Maine fab to Diodes following the closure of its Oudenarde, Belgium fab last month. “The proposed divestitures show that we are well on our way to achieve an optimized manufacturing network while supporting our customers with long-term assurance of supply,” says CEO  Hassane El-Khoury, “the transactions provide employees at ...

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Ten steps to designing an SoC

Sondrel has come up with a ten step guide to designing an SoC. They are: Break the problem into stages using a divide and conquer methodology? As the level of detail increases at each stage, consider fewer options for exploratiion Focus resources as process progresses Avoid wasted simulation time Reduce data-set to be analysed Reduce ...

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