‘Zeptogram’ caught the eye at ISSCC 2022 conference last week, as researchers from French lab CEA-Leti produced a mass sensor with 170zg resolution for weighing molecules. Not only did they make one such sensitive weighing scale, but 1,024 of them in an array which can be scanned at high speed. The weighing part had been ...
This story continues at ISSCC 2022: MEMS senses zeptograms
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Four out of the top seven executives of Arm have now left the company following a clear-out by new CEO Rene Haas. Former CEO Simon Segars was replaced innediately after Softbank announced the failure of the Nvidia bid. Now CTO Dipesh Patel, Carolyn Herzog, the head of the legal team and chief strategy officer Jason ...
This story continues at Arm clears out top management
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Intel has chosen Magdeburg in eastern Germany as its European fab site, reports Reuters. It is Intel’s third announcement of a potential multi-fab site in a year. Last March it announced it would build two fabs un Arizona, and in January it announced a multi-fab site in Ohio. Intel has indicated in the past that ...
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Executives from NTT-DOCOMO will give live presentations on O-RAN at MWC in Barcelona this week: Seizo Onoe, Chief Standardization Strategy Officer of NTT CORP. and Fellow of NTT DOCOMO, will make a presentation during OpenRAN: A Vision of 5G & the Future of 6G at MWC Stage A in Hall 5 on Monday, February 28 from 13:15–14:15 ...
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The Telecom Infra Project (TIP) OpenRAN Project Group has just published its Release 2 Roadmap Document after conducting a thorough industry review with input from both the supply and the demand sides – including some of the world’s largest operators. Last June, TIP published the ‘Open RAN Technical Priorities Document’ – a comprehensive list of technical requirements that the signatories ...
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Intelsat has officially completed its almost two-year-long financial restructuring process, having filed a voluntary Chapter 11 petition in the U.S. Bankruptcy Court for the Eastern District of Virginia in 2020. The final milestone was receipt of regulatory approvals, completion of certain corporate actions, and satisfaction of other customary conditions, it has announced. The reorganisation has ...
This story continues at Intelsat exits Chapter 11 two years on, halving debt
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The fastest bendable 8bit thin-film microcontroller was describe at the International Solid-State Circuits Conference this week. Designed by Belgian research lab Imec and nearby university KU Leuven, it was made by UK-based PragmatIC Semiconductor. Called Flex6502, is has 16,000 0.8µm gate-length IGZO (indium gallium zinc oxide) transistors over a 4.5 x 5.5mm active area (see photo, ...
This story continues at ISSCC: UK-made bendable 6502 MCU has 16,000 thin-film transistors
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EPC is offering a three-phase motor driver evaluation board built around 80V 3.6mΩ GaN power transistors, sized for drones, robotics and e-bikes. “The small size of this inverter allows integration into the motor housing resulting in the lowest EMI, highest density and lowest weight,” said the company. Called EPC9167HC, the design uses two paralleled EPC2065 ...
This story continues at 60V 30A GaN motor drive for drones, robotics and e-bikes
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Diodes has launched a series of automotive-compliant synchronous buck converters for delivering up to 3A in automotive point-of-load converters in 3 x 2.8mm TSOT26 packages With 2A and 3A ratings, AP6320xQ and AP6330xQ respectively can operate with inputs from 3.8 to 32V and over -40 to +125°C. 3A versions integrate 70/40mΩ (high/low-side) mosfets, or 125/68mΩ for the 2A parts. There are ...
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Murata has managed to compress 4.3μF into a three-terminal 0402 (1005 metric) package, and qualified it for automotive use. This is the surface-mount equivalent of a feed-through capacitor, with the end terminals connected together by a low-resistance direct path. This path is one end of the capacitor, whose other end is to be grounded via ...
This story continues at Automotive three-terminal capacitor packs 4.3μF into 0.5mm2
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