NXP and Hitachi have co-designed a gate driver evaluation board for Hitachi’s 1.2kV RoadPak SiC mosfet half-bridges. The half-bridges are ~75 x 70mm and come in 580, 780 and 980A versions which are liquid-cooled – one side having a pin-fin array (just visible right) which has to be sealed into a water-glycol filled cooling manifold. Junction ...

This story continues at NXP and Hitachi collaborate on SIC power stage for vehicle traction inverters

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