Skywater, Deca sign packaging pact

SkyWater Technology,  the Minnesota specialist foundry, and Deca Technologies, the packaging specialist have agreed a deal to use Deca’s second generation M-Series fan-out wafer-level packaging (FOWLP) technology with Adaptive Patterning in SkyWater’s packaging facility in Florida. The companies are endeavoring to establish the first high volume FOWLP capability in the U.S. to bring proven solutions for ...

This story continues at Skywater, Deca sign packaging pact

Or just read more coverage at Electronics Weekly