Dual mosfets combine n-channel and p-channel for 24V motor drives, plus dual n-channels too

Rohm has co-packaged n and p-channel mosfets with ±40V or ±60V withstand voltages to provide overhead for driving motors at 24V. “In recent years, mosfets are increasingly required to ensure sufficient margin against voltage fluctuations by providing 40V and 60V withstand voltages to support 24V input required for motors used in industrial equipment and base ...

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Brick-style mains PSUs use GaN to shrink dimensions

CUI has turned to GaN transistors to shrink its 300W and 120W mains adapters. “Due to their compact size, these ac-dc supplies are ideal for a variety of portable consumer and industrial applications like sequencing, molecular testing, and livestock tracking,” according to the company. SDI300G-U 300W continuous, 183 x 83 x 35, IEC Class I safety ...

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Low-power Cortex-M23 MCUs for IoT end-points

Renesas is using Arm’s Cortex-M23 core in a microcontrollers intended for IoT end-points. Called the RA2E2 Group and part of the RA Family, they are nine small MCUs that consume little: being available in the 1.87 x 1.84mm 16pin WLCSP (wafer-level chip-scale package) and operating at 81μA/MHz, dropping to 200nA in software stand-by with fast wake. Operation ...

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Just Encase

element14 and Hammond Enclosures have laid down the “Just Encase” challenge to create projects designed to withstand  the harshest environments. The challenge encourages the element14 Community to create a new design built to work reliably even in the face of extreme heat, cold, water or humidity. The challenge is open to everyone. Members of the ...

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67th IEDM to consider 2D materials and 3D architectures

The 2021 IEEE International Electron Devices Meeting will be an in-person event in San Francisco, CA from Dec. 11-15, with on-demand content available afterward. Selected Technical Highlights: A Stretchable Amplifier for Smart Textiles, from a Tsinghua University-led team 3D at the Device Level, from IBM and Samsung GaN Meets Moore’s Law, from Intel GaN at ...

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Skywater, Deca sign packaging pact

SkyWater Technology,  the Minnesota specialist foundry, and Deca Technologies, the packaging specialist have agreed a deal to use Deca’s second generation M-Series fan-out wafer-level packaging (FOWLP) technology with Adaptive Patterning in SkyWater’s packaging facility in Florida. The companies are endeavoring to establish the first high volume FOWLP capability in the U.S. to bring proven solutions for ...

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BLE node in 8x8x1mm module

Insight SiP, the specialist in miniature RF modules, is launching a module with a dual-core ARM processor, BLE 5.2 Long Range connectivity, capability to support BLE Audio, and security features with ARM Trustzone in a package measuring 8 x 8 x 1mm, With extended temperature capability up to 105oC, this device can support every kind of advanced ...

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ICEYE signs up to provide imagery for Copernicus satellite programme

The Finnish satellite imagery specialist ICEYE has signed up to participate in the European Space Agency’s (ESA) Copernicus Earth observation satellite programme. The company, which specialises in the persistent monitoring of the Earth with radar satellite imaging, has agreed to become a “Contributing Mission” to the programme. What this means is that Copernicus services will ...

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Northrop Grumman to design SIGINT sensor prototype for U.S. Air Force

Northrop Grumman has been awarded a contract by the U.S. Air Force to design a next-generation signals intelligence (SIGINT) sensor. It will be used for high-altitude intelligence, surveillance, and reconnaissance (ISR) platforms Under the Air Force’s Global High-altitude Open-system Sensor Technology (GHOST) programme, the company will deliver a design of a prototype sensor. This will ...

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Aprisa physical design software upgraded

Siemens Digital’s  latest release of its Aprisa physical design software – Aprisa 21.R1 – is now available. Improvements include: • Average full-flow runtime reduction of 30% compared to the previous release, and up to 2X faster runtimes for larger, more challenging designs. • Enhancements to all major place-and-route engines, from placement optimization to clock tree ...

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