element14 and Hammond Enclosures have laid down the “Just Encase” challenge to create projects designed to withstand the harshest environments. The challenge encourages the element14 Community to create a new design built to work reliably even in the face of extreme heat, cold, water or humidity. The challenge is open to everyone. Members of the ...
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The 2021 IEEE International Electron Devices Meeting will be an in-person event in San Francisco, CA from Dec. 11-15, with on-demand content available afterward. Selected Technical Highlights: A Stretchable Amplifier for Smart Textiles, from a Tsinghua University-led team 3D at the Device Level, from IBM and Samsung GaN Meets Moore’s Law, from Intel GaN at ...
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SkyWater Technology, the Minnesota specialist foundry, and Deca Technologies, the packaging specialist have agreed a deal to use Deca’s second generation M-Series fan-out wafer-level packaging (FOWLP) technology with Adaptive Patterning in SkyWater’s packaging facility in Florida. The companies are endeavoring to establish the first high volume FOWLP capability in the U.S. to bring proven solutions for ...
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Insight SiP, the specialist in miniature RF modules, is launching a module with a dual-core ARM processor, BLE 5.2 Long Range connectivity, capability to support BLE Audio, and security features with ARM Trustzone in a package measuring 8 x 8 x 1mm, With extended temperature capability up to 105oC, this device can support every kind of advanced ...
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The Finnish satellite imagery specialist ICEYE has signed up to participate in the European Space Agency’s (ESA) Copernicus Earth observation satellite programme. The company, which specialises in the persistent monitoring of the Earth with radar satellite imaging, has agreed to become a “Contributing Mission” to the programme. What this means is that Copernicus services will ...
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Northrop Grumman has been awarded a contract by the U.S. Air Force to design a next-generation signals intelligence (SIGINT) sensor. It will be used for high-altitude intelligence, surveillance, and reconnaissance (ISR) platforms Under the Air Force’s Global High-altitude Open-system Sensor Technology (GHOST) programme, the company will deliver a design of a prototype sensor. This will ...
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Siemens Digital’s latest release of its Aprisa physical design software – Aprisa 21.R1 – is now available. Improvements include: • Average full-flow runtime reduction of 30% compared to the previous release, and up to 2X faster runtimes for larger, more challenging designs. • Enhancements to all major place-and-route engines, from placement optimization to clock tree ...
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Texas Instruments is claiming “industry’s most accurate 3D Hall-effect position sensor” for one that provides 2.6% full-scale total error at room temperature. The first device in a family of 3D Hall-effect position sensors, TMAG5170 is intended for factory automation and motor-drives. Using the SPI interface, sensitivity is individually settable for each axis over ±25, ±50 ...
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New Yorker Electronics has signed up as a franchised distributor of Texas-based Knight Electronics and its subsidiaries Orion Fans and Io Audio Technologies. Orion Fans designs, develops and manufactures fans, fan trays, motorised impellers and blowers. Io Audio Technologies designs, develops and manufacturers audio, video and lighting products including cables, cable protectors, connectors and wires. ...
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AI chipmaker Hailo today announced it has raised $136 million in a Series C funding round led by Poalim Equity and Gil Agmon. The round was joined by existing investors, including Hailo Chairman Zohar Zisapel, Swiss-based ABB Technology Ventures (ATV), London’s Latitude Ventures, Israel’s OurCrowd, and new investors, including Carasso Motors, Comasco, Shlomo Group, Talcar Corporation ...
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