Marvell has announced IP cores for datacentre ICs using TSMC’s 3nm silicon process for a standards-based silicon platform with die-to-die interface IP and TSMC’s  2.5D Chip-on-Wafer-on-Substrate (CoWoS) packaging technology. The two  complementary  die-to-die interfaces are: First, a flexible extra short reach (XSR) interface for connecting multiple die on a package substrate for applications, like co-packaged ...

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