PCIM 2019: Video Interview – Nexperia’s LFPAK family offer a 60% footprint reduction and lower profile

At PCIM 2019, we caught up with Chris Boyce of Nexperia as part of our promotional coverage for the event. He discusses Nexperia’s new LFPAK family of products – specifically, the LFPAK88 – that result in 40V MOSFETs delivering a low RDS(on) of 0.7mΩ. The LFPAK88 devices replace larger power packages such as D²PAK and ...

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