PCIM 2019: Video Interview – Power Integrations on silicon carbide efficiencies

At PCIM 2019, we caught up with Balu Balakrishnan of Power Integrations as part of our promotional coverage for the event. At the show, Power Integrations was highlighting its new SCALE-iDriver SiC technology family. He talks silicon carbide with reference to automotive applications and the technology’s significance for smaller die sizes, efficiency and a smaller ...

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Novel mems devices get investment

Novel mems technology firm ​Integra Devices has completed a $6 million series-A funding. The Californian company has taken packaging technology, rather than silicon lithography, as the base on which it builds micromachines – created from over 15 years of research and over $20m in funding at the University of California, Irvine, according to the firm. For example, ...

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PCIM 2019: Video Interview – Rohde & Schwarz on T&M for power electronics

At PCIM 2019, we caught up with Dr Markus Herdin of Rohde & Schwarz as part of our promotional coverage for the event. He discusses the Rohde & Schwarz family of oscilloscopes and power supplies for power electronics applications at PCIM Europe 2019. Specifically, high-sensitivity oscilloscopes with fast FFT functionality for EMI debugging in fast ...

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Assembly Plants at the Forefront of Industry 4.0

Factories of the future will feature advanced technology, such as additive manufacturing, artificial intelligence, augmented reality, data analytics and digital twins. While many manufacturers are still ramping up their Industry 4.0 initiatives, several assembly plants are already at the forefront. They are embracing the Fourth Industrial Revolution and reaping the benefits.

Researchers bind hydrogen atoms to graphene giving it a bandgap

Researchers at the University of Gottingen have found a way to bind hydrogen atoms to graphene. Graphene cannot be used as a semiconductor, because it doesn’t have a bandgap.  By sticking hydrogen atoms to graphene  a bandgap can be formed. The researchers  bombarded graphene with hydrogen atoms. “The hydrogen atoms behaved quite differently than we ...

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Uber IPOs

Today Uber goes public. It is pricing its shares at $45 each giving the company a valuation of $82.4 billion – about a third less than the $120 billion valuation being talked about at  the beginning of the year. Uber seems to want to avoid the experience of competitor Lyft which went public at $72 ...

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Hynix sampling 96-layer Tb NAND

Hynix says it is sampling its 96-layer Tbit  QLC ‘4D’ NAND. Hynix calls its technology 4D  because it combines 3D Charge Trap Flash technology (CTF) with Periphery Under Cell (PUC). Hynix says 96-layers gives 49% improved bit density over 72-layer 3D NAND products. Hynix plans to develop a QLC software algorithm and controller and launch its ...

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TT debuts Pola Power

TT Electronics has brought out a connector called Pola Power approved for use on rail and military vehicles that can also be qualified to suit other applications in the power distribution and green energy markets such as gearboxes, air conditioning, supper-accumulators and batteries. This highly single pole power connector with bayonet coupling offers a finger ...

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