A new route to self-heating clothing

As a way to turn cloth into heating elements for self-warming clothing, engineers at Rutgers University in the US have used high-intensity light pulses to fuse silver nano-wires onto polyester fibres – something called intense pulsed-light scintering. While delivering sufficient energy to bond the silver wires to the cloth fibres, the underlying polymer is not ...

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Folding drone flies through small holes

A drone that can fold-up during flight to get through narrow gaps has been created by the University of Zurich. Servo-driven sideways folding hinges allow it to adopt normal, long-thin and compact configurations and, crucially, its real-time control system adjusts rotor thrust to retain controlled stable flight as morphing shifts the center of gravity. “Our ...

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Binary Bots from Farnell

Premier Farnell is to distribute the Binary Bots range of educational robots. BinaryBots specialise in developing educational robot starter kits to help teachers make Physical Computing and core STEM principles simple and fun for children aged eight years old and above. With a strong focus on accessibility and affordability, their products include a ‘Cardboard2Code’ beginners range<https://uk.farnell.com/search?st=binarybots%20binary>, ...

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SST embeds NOR flash in Hynix 110nm foundry process

Silicon Storage Technology (SST) is to work with Hynix System IC on embedding NOR memory in Hynix’s 110nm CMOS process. SST, now a subsidiary of Microchip,  calls its embedded NOR ‘SuperFlash’. SST claims that SuperFlash delivers low-power, high reliability, fast erase, and superior data retention and endurance for a range of applications, such as IoT, smart ...

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Intel debuts Foveros

Intel has cone up with a packaging technology called  ‘Foveros’. Foveros ‘paves the way for devices and systems combining high-performance, high-density and low-power silicon process technologies,’ says Intel, ‘Foveros is expected to extend die stacking beyond traditional passive interposers and stacked memory to high-performance logic, such as CPU, graphics and AI processors.’ Intel adds that ...

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AVX adds 2.55mm profile IDC

AVX has added a new part to its 9176-800 Series low-profile insulation displacement connectors (IDCs) — the first and currently only industrial IDCs available in a 2.55mm profile — to accommodate an additional wire gauge and further expand application suitability. Now available in one to four positions in each of four wire gauges, the series’ ...

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Jacarem signs franchise for EDAC connectors

Connector distributor and cable assembly manufacturer, Jacarem, has signed a franchise distribution agreement with interconnect specialist, EDAC. The latter provides card edge, rack and panel, RJ45 and telecomms jacks, USB and FireWire, waterproof connectors and PLCC sockets. MH Connectors, which manufactures connectors, hoods and covers, is also part of the EDAC group. The D-sub hoods ...

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600V super-junction mosfets optimised for soft switching

STMicroelectronics’ MDmesh M6 600V super-junction transistors are aimed at medium-power resonant and hard-switching converter topologies. There are 37 part numbers covering 13 to 72A, with threshold voltage optimised for soft switching, suiting the transistors LLC resonant converters and boost-PFC converters. Rds(on) to as low as 36mΩ. For hard-switching topologies, the capacitance profile is claimed to enhance ...

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Putting the boot into Industry 4.0 education

Students in the School of Mechanical and Materials Engineering at University College Dublin can learn production technologies for Industry 4.0, or the smart factory, with hands-on experience via an automated factory demonstration unit, donated by Maxim Integrated Products. The football factory demo was popular at exhibitions around Europe, where it was used to showcase the ...

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Gyrfalcon launches AI accelerator with eMRAM.

Gyrfalcon Technology, the 11-month-old Milpitas specialist in AI accelerator ICs, has announced commercial availability of a 22nm ASIC with embedded MRAM called the LightspeeurÒ 2802M. Gyrfalcon claims the chip is the industry’s first AI Accelerator to use MRAM. The chip has a density of  50 F and and a read speed of 45-60ns. It has 40MB of memory, which can support ...

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