Low ohmic resistors sense current in inverters and appliances

Rohm has announced a line-up of high power wide terminal thick-film chip resistors intended for current detection in applications including inverters and home appliances. Ranging from 10 to 910mΩ in 48 values, the parts are called LTR50. “A thorough review of the resistive material allowed Rohm to improve rated power to 2W in the 2.5 x ...

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A new route to self-heating clothing

As a way to turn cloth into heating elements for self-warming clothing, engineers at Rutgers University in the US have used high-intensity light pulses to fuse silver nano-wires onto polyester fibres – something called intense pulsed-light scintering. While delivering sufficient energy to bond the silver wires to the cloth fibres, the underlying polymer is not ...

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Folding drone flies through small holes

A drone that can fold-up during flight to get through narrow gaps has been created by the University of Zurich. Servo-driven sideways folding hinges allow it to adopt normal, long-thin and compact configurations and, crucially, its real-time control system adjusts rotor thrust to retain controlled stable flight as morphing shifts the center of gravity. “Our ...

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Binary Bots from Farnell

Premier Farnell is to distribute the Binary Bots range of educational robots. BinaryBots specialise in developing educational robot starter kits to help teachers make Physical Computing and core STEM principles simple and fun for children aged eight years old and above. With a strong focus on accessibility and affordability, their products include a ‘Cardboard2Code’ beginners range<https://uk.farnell.com/search?st=binarybots%20binary>, ...

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SST embeds NOR flash in Hynix 110nm foundry process

Silicon Storage Technology (SST) is to work with Hynix System IC on embedding NOR memory in Hynix’s 110nm CMOS process. SST, now a subsidiary of Microchip,  calls its embedded NOR ‘SuperFlash’. SST claims that SuperFlash delivers low-power, high reliability, fast erase, and superior data retention and endurance for a range of applications, such as IoT, smart ...

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Intel debuts Foveros

Intel has cone up with a packaging technology called  ‘Foveros’. Foveros ‘paves the way for devices and systems combining high-performance, high-density and low-power silicon process technologies,’ says Intel, ‘Foveros is expected to extend die stacking beyond traditional passive interposers and stacked memory to high-performance logic, such as CPU, graphics and AI processors.’ Intel adds that ...

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AVX adds 2.55mm profile IDC

AVX has added a new part to its 9176-800 Series low-profile insulation displacement connectors (IDCs) — the first and currently only industrial IDCs available in a 2.55mm profile — to accommodate an additional wire gauge and further expand application suitability. Now available in one to four positions in each of four wire gauges, the series’ ...

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