Molex has launched its  Wi-Fi flexible antenna series –  the 206994-series of side-fed cable-flexible antenna – for space-constrained applications. When center-fed cable antennas do not address the needs of particular applications, side-fed cable antenna designs are required and Molex has developed two side-fed cable antenna versions: the 206994-series monopole and the 204281-series dipole-style side-fed flex antennas. ...

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Contract prices of NAND are expected to drop 10%, says DRAMeXchange. NAND bit output is higher than expected thanks to steady yields on 64-layer 3D NAND production, but demand has been hit by the US-China trade war, the shortage of Intel CPUs and lower than expected iPhone sales. Even the eMMC/UFS sector, which had a ...

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Samsung is leading in EUV manufacturing, it was revealed at IEDM. Samsung is currently ramping a 7nm process which uses EUV for seven layers. TSMC appears to be second in EUV usage with the intention of starting to ramp a 7nm process which uses EUV for six layers early in 2019. Intel is not planning ...

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Hitachi is to take over the power grid business of Swisss engineering group ABB. Initially, Hitachi will pay $6.4 billion for 80% of the business and, after four years, it will buy the remaining 20%. The first part of the deal is set to close in H1 2020. The idea is to make Hitachi better ...

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The polymeric materials market revenue will double over the next five years, says Yole Développement, driven by miniaturisation and higher functionalities in applications like AI, 5G, and AR/VR requiring packaging including high-density FOWLP, 3D stacked TSV, WLCSP and flip-chip.    “The innovative advanced packaging platforms have reached a new level of complexity and now demand higher ...

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DRAM was the fastest growing chip product in 2018, says IC Insights. The 2018 DRAM market is expected to show an increase of 39%, a solid follow-up to the 77% growth in 2017. It was also the fastest-growing IC segment in 2013 and 2014.   IC Insights forecasts that DRAM will rank nearly last in ...

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