Fab equipment spending in 2019 is projected to drop 8%, down from the previously forecast increase of  7%, says SEMI. Total fab investment growth has been revised downward for 2018 to 10% from the 14% predicted in August. Entering 2018, the semiconductor industry was expected to show a rare fourth consecutive year of equipment investment ...

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Suffering from a shortage of capacity for CPUs, Intel is now moving early to ensure that it will have futire capacity when it needs it. The company says it has begun talks with the planning authorities in Israel, Ireland and Oregon about extending capacity  at those sites. The inetention is that construction could begin at ...

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Molex has launched its  Wi-Fi flexible antenna series –  the 206994-series of side-fed cable-flexible antenna – for space-constrained applications. When center-fed cable antennas do not address the needs of particular applications, side-fed cable antenna designs are required and Molex has developed two side-fed cable antenna versions: the 206994-series monopole and the 204281-series dipole-style side-fed flex antennas. ...

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Contract prices of NAND are expected to drop 10%, says DRAMeXchange. NAND bit output is higher than expected thanks to steady yields on 64-layer 3D NAND production, but demand has been hit by the US-China trade war, the shortage of Intel CPUs and lower than expected iPhone sales. Even the eMMC/UFS sector, which had a ...

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Samsung is leading in EUV manufacturing, it was revealed at IEDM. Samsung is currently ramping a 7nm process which uses EUV for seven layers. TSMC appears to be second in EUV usage with the intention of starting to ramp a 7nm process which uses EUV for six layers early in 2019. Intel is not planning ...

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Hitachi is to take over the power grid business of Swisss engineering group ABB. Initially, Hitachi will pay $6.4 billion for 80% of the business and, after four years, it will buy the remaining 20%. The first part of the deal is set to close in H1 2020. The idea is to make Hitachi better ...

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The polymeric materials market revenue will double over the next five years, says Yole Développement, driven by miniaturisation and higher functionalities in applications like AI, 5G, and AR/VR requiring packaging including high-density FOWLP, 3D stacked TSV, WLCSP and flip-chip.    “The innovative advanced packaging platforms have reached a new level of complexity and now demand higher ...

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DRAM was the fastest growing chip product in 2018, says IC Insights. The 2018 DRAM market is expected to show an increase of 39%, a solid follow-up to the 77% growth in 2017. It was also the fastest-growing IC segment in 2013 and 2014.   IC Insights forecasts that DRAM will rank nearly last in ...

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