Sharp to spin off semi business

Sharp is to spin off its semiconductor business, reports The Japan Times. The spin-off, which is designed to speed up management decision-making, enable outside investment and facilitate external partnerships could happen as early as April. The spin-off will see the semi business split into two wholly-owned subsidiary companies one for chips and sensors and the ...

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Huawei first to use TSMC EUV

HiSilicon, Huawei’s chip subsidiary, will be the first customer to use a TSMC process using EUV, reports China’s Commercial Times. The process labelled N7 Plus, is due for production in Q1 2019. A follow-up process using EUV, N5, is due for production in 2020. Huawei is TSMC’s second largest customer after Apple. TSMC is expected ...

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Trump ponders banning Chinese switchgear

President Trump is considering an executive order upping the stakes in the US-China trade war, reports Reuters. The order would ban all US companies from buying switchgear from Huawei and ZTE. Since Huawei equipment is said to cost a quarter of Ericsson equipment, this would hit US companies, especially smaller ones in rural areas, very ...

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Huawei anticipates being No.1 smartphone vendor in 2019

Huawei reckons it could be the world No.1 smartphone vendor in 2019. “In the global smartphone market, Huawei has gone from being dismissed as a statistical ‘Other’ to ranking among the top 3 players in the world,” says the company, “in Q4 next year, it’s possible we become No. 1” The company says it sold ...

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Sinclair invention gene rides again

The inventive Sinclair gene rides again as Sir Clive’s nephew, Grant Sinclair, launches a  build-your-own pocket games machine. Grant’s product is called POCO, standing for Pocket Raspberrry Pi Gaming Kit. It includes a Raspberry Pi motherboard,  a wide-angle camera, loudspeaker, touch screen and control pads. About the size of a smartphone, POCO  allows users to ...

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Get a second source TSMC tells 8-inch customers

TSMC has advised customers for 8-inch wafers to use multiple sources, reports Digitimes, because demand looks like exceeding supply right through 2019. Last week TSMC said it was looking to build a new 8-inch fab in Tainan. The last time it built an 8-inch fab was 15 years ago The demand is coming from customers ...

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Mobile Semiconductor launches FDX memory compiler

Mobile Semiconductor has announced a 22nm FDX ULP (Ultra Low Power) Memory Compiler. The Memory Compiler offers an Ultra-Low Power mode at 0.65V that is useful to a wide range of wearable and battery powered devices. The 22nm FDX ULP joins their expanding 22nm FDX Memory Compiler family that currently covers a wide range of ...

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ROHM claims the smallest contactless current sensor

ROHM claims to have launched the industry’s smallest contactless current sensor, the BM14270MUV-LB. It achieves minimum power loss (no heat generation) in an ultra-compact size, making it ideal for industrial equipment and consumer devices that detect operating conditions via current, including battery-driven drones, solar power systems, and servers in data centers requiring high power. In ...

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