Leti and  Silvaco Are to create unified SPICE compact models for the design of  ICs using nanowire and nanosheet technologies. The new predictive and physical compact model under development, Leti-NSP, builds on Leti’s 15 years of model development, including the Leti-UTSOI model for FD-SOI technology. The Leti-NSP compact model uses a novel methodology for the ...

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