Infineon is claiming a first, with an industrial-grade embedded SIM (eSIM) in a 2.5 x 2.7mm wafer-level chip-scale package (WLCSP). It is aimed at machine-to-machine comms and IoT applications, for example vending machines, remote sensors and asset trackers. “Providing robust quality on a miniature footprint that works even under harshest conditions remains a challenge for silicon ...

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