HiSilicon, Huawei’s chip subsidiary, will be the first customer to use a TSMC process using EUV, reports China’s Commercial Times. The process labelled N7 Plus, is due for production in Q1 2019. A follow-up process using EUV, N5, is due for production in 2020. Huawei is TSMC’s second largest customer after Apple. TSMC is expected ...

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