Toshiba is sampling shipments embedded NAND flash memory products for automotive applications that are compliant with JEDEC UFS version 2.1. The products meet AEC-Q100 Grade 2[3]requirements, support the wide temperature range of -40°C to +105°C, and offer the enhanced reliability capabilities that are required by increasingly complex automotive applications. The devices integrate NAND chips fabricated ...
This story continues at Toshiba sampling UFS 2.1-compliant eNAND for auto
Or just read more coverage at Electronics Weekly