Industrial connector supports 10Gbit/s Ethernet

TE Connectivity has added a Cat6A cable connector to its Mini I/O family of industrial connectors supporting serial, bus and Ethernet communication up to 10Gbit/s (Cat6A) data speeds. Design of the Mini I/O connector offers a stable connection due to a stable mechanical interface and double spring/double contact point layout. It is also designed to ...

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Qualcomm sampling Snapdragon 845

Qualcomm is sampling its latest Snapdragon processor – the Snapdragon 845. It stays on the same 10nm node at Samsung as its predecessor and emphasises AR capabilities. Features include: Qualcomm Spectra 280 ISP -Ultra HD premium capture -Qualcomm Spectra Module Program, featuring Active Depth Sensing -MCTF video capture -Multi-frame noise reduction -High performance capture up ...

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CMOS will cut cost of integrated photonics, says Leti

French research group Leti has demonstrated a III-V semiconductor fabrication technique which it says will simplify the production of lasers. Leti says it has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow. “This shows the way to transitioning away from 100mm wafers and a process based on bulk III-V technology ...

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Kyocera shows its smallest capacitor

Kyocera has developed its smallest multilayer ceramic capacitors (MLCCs) measuring just 0.25 x 0.125 x 0.125mm. The CM01 series MLCCs are designated as having a 008004 case size. The company has used proprietary electrode printing and forming technologies to reduce MLCC’s space requirement by 60% in mounting area and 75% in total volume, as compared ...

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Fujitsu bonds diamond to SiC at room temperature.

Fujitsu has developed a technology for bonding single-crystal diamond to a SiC substrate at room temperature. Using this technology for heat dissipation in a high-power GaN high HEMT enables stable operations at high power levels. Application of this technology is expected to significantly enhance the performance of weather radars and wireless communications. Boosting range and ...

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TUM reduces risk of lithium plating

When lithium-ion batteries are charged too quickly, metallic lithium gets deposited on the anodes. This reduces battery capacity and lifespan and can even destroy the batteries.   Scientists at the Technical University of Munich (TUM) and the Forschungszentrum Jülich have now presented a process that, for the first time ever, allows this so-called lithium plating ...

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Imec analysis confirms benefit of 3-D heterogeneous integration

Imec has produced  the first power-performance-area-cost (PPAC) analysis of different sequential 3D-integration variants using advanced 5nm and 3nm CMOS technology nodes. The most significant benefit was found for a heterogeneous sequential-3D integration approach that uses different device layers (or tiers) for the non-scalable (analog and I/O) and scalable parts (logic and memory) of the system. ...

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UltraSoC and Percepio hook up

UltraSoC, the embedded analytics specialist, and Percepio, the RTOS tracing tools vendor, are getting together to produce a comprehensive product for  designing and debugging complete real-time systems. Combining Percepio’s Tracealyzer tools to provide insight into real-time behaviors in RTOS-based (real-time operating system) embedded software, with UltraSoC’s hardware-based universal monitoring and analytics platform, the partnership allows ...

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LETI integrates III-V lasers on 200mm wafers using CMOS flow

  Leti has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow. This shows the way to transitioning away from 100mm wafers and a process based on bulk III-V technology that requires contacts with noble metals and lift-off based patterning. The project, carried out in the framework of the IRT Nanoelec ...

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