Laird’s TEM accommodates laser diode butterfly package

Laird has developed a thermoelectric module (TEM) that accommodates a laser diode butterfly package. Primarily used to stabilize the temperature of sensitive optical components in telecom and photonics industries, the miniature OptoTEC Series is designed for applications that have lower cooling requirements of 10 watts or less. The OptoTEC Series combines a small geometric footprint ...

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Prince Henry’s Grammar School wins Farnell Technology Challenge

  Students from Prince Henry’s Grammar School, Otley, Leeds fought off tough competition from 10 other schools and colleges in Yorkshire to be named overall winners at the Premier Farnell Technology Challenge at Aspire, Leeds on Tuesday. The challenge also crowned Shipley College as runners up, receiving the People’s Champion award, voted for by students ...

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Toshiba to sample 4-channel class-AB linear PA in January

In January, Toshiba is to start sampling  a 4-channel, high-efficiency class-AB linear power amplifier IC that delivers high-quality sound reproduction for car audio applications while significantly reducing power consumption. Offering efficiency comparable to class-D digital amplifiers, the TCB701FNG IC uses patented technology to operate at just 10% of the power of conventional class-AB amplifiers (under normal ...

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Grippers for Small Parts

For manufacturers, the product-miniaturization trend is kind of a Catch-22. They know that serving a large and ever-expanding marketplace ensures company growth—so long as their robots can precisely place ever-smaller parts into subassemblies, final assemblies or packaging. Specially designed small grippers and vacuum cups have enabled many manufacturers to achieve both goals.

Industrial connector supports 10Gbit/s Ethernet

TE Connectivity has added a Cat6A cable connector to its Mini I/O family of industrial connectors supporting serial, bus and Ethernet communication up to 10Gbit/s (Cat6A) data speeds. Design of the Mini I/O connector offers a stable connection due to a stable mechanical interface and double spring/double contact point layout. It is also designed to ...

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Qualcomm sampling Snapdragon 845

Qualcomm is sampling its latest Snapdragon processor – the Snapdragon 845. It stays on the same 10nm node at Samsung as its predecessor and emphasises AR capabilities. Features include: Qualcomm Spectra 280 ISP -Ultra HD premium capture -Qualcomm Spectra Module Program, featuring Active Depth Sensing -MCTF video capture -Multi-frame noise reduction -High performance capture up ...

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CMOS will cut cost of integrated photonics, says Leti

French research group Leti has demonstrated a III-V semiconductor fabrication technique which it says will simplify the production of lasers. Leti says it has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow. “This shows the way to transitioning away from 100mm wafers and a process based on bulk III-V technology ...

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Kyocera shows its smallest capacitor

Kyocera has developed its smallest multilayer ceramic capacitors (MLCCs) measuring just 0.25 x 0.125 x 0.125mm. The CM01 series MLCCs are designated as having a 008004 case size. The company has used proprietary electrode printing and forming technologies to reduce MLCC’s space requirement by 60% in mounting area and 75% in total volume, as compared ...

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Fujitsu bonds diamond to SiC at room temperature.

Fujitsu has developed a technology for bonding single-crystal diamond to a SiC substrate at room temperature. Using this technology for heat dissipation in a high-power GaN high HEMT enables stable operations at high power levels. Application of this technology is expected to significantly enhance the performance of weather radars and wireless communications. Boosting range and ...

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