Leti has  combined FD-SOI technology with its 3D CoolCube monolithic stacking technology to create 4T SRAM bitcells with the same functionality level of 6T bitcells, reducing die size by 30%. With SRAM taking up to 90% of some SoCs, this is a major innovation. “In the longer term, Leti’s CoolCube technology will be able to ...

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