Imec has produced  the first power-performance-area-cost (PPAC) analysis of different sequential 3D-integration variants using advanced 5nm and 3nm CMOS technology nodes. The most significant benefit was found for a heterogeneous sequential-3D integration approach that uses different device layers (or tiers) for the non-scalable (analog and I/O) and scalable parts (logic and memory) of the system. ...

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