Globalfoundries has demonstrated silicon functionality of  a 2.5D package for its high-performance 14nm FinFET  FX-14 integrated design system for ASICs.   The 2.5D ASIC package has a stitched interposer capability to overcome lithography limitations and a two terabits per second (2Tbps) multi-lane HBM2 PHY, developed in partnership with Rambus. B It will also be used for GloFo’s 7nm Finfet process. ...

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