In a silicon-compatible parallel to fibre optics, MIT is using polymer-based ribbon waveguides to carry data between chips at 105Gbit/s – waveguide dimensions and material are chosen so that it propagates electromagnetic radiation between 200 and 335GHz, over 300mm of waveguide. To handle suitable sub-Thz frequencies, transmitter and receiver were made on a 130nm SiGe BiCMOS process ...

This story continues at ISSCC 2021: MIT links silicon chips at 100Gbit/s with dielectric ribbon

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