Nexperia is claiming to have squeezed a 40V mosfet with 0.7mΩ Rds(on) into 8 x 8mm, using its LFPAK88 package and its latest (Trench9) silicon – intending to displace D²PAK and D²PAK-7 devices – saving 60% of footprint and with a 64% lower profile. “Unlike packages where performance is often limited by internal bond wires, ...

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