650V automotive-grade SiC mosfet launches ST’s Gen3

STMicroelectronics had debuted its third generation of silicon carbide mosfet with a 650V device aimed at electric-vehicle power-trains. Called SCT040H65G3AG, the part typically has a 40mΩ on-resistance and can carry 30A through its Kelvin source H2PAK-7 package (right). Regarding gen 3 “ST’s new SiC devices are specifically optimised for automotive applications including traction inverters, on-board chargers and dc-dc ...

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Supercapacitor electrodes made of organic material

Sweden’s Digital Cellulose Center is storing electricity on ‘electronic paper’ completely made of organic material. The ingredients are cellulose, conductive polymers and bio-based charcoal from coconuts, and the result is durable, electrically conductive and has a large surface area structure that can bind energy-storing materials. “Our goal is to use the paper material to build ...

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UK made: Register memory IP cuts SoC power for wearables

Sheffield memory design house SureCore is offering intellectual property to cut register file power consumption. Branded MiniMiser, its architecture is based on a customised storage element – rather than on the foundry bit cell – and exploits the company’s SRAM power saving techniques. Multi-port and high-performance variants can be generated. “MiniMiser gives developers a new way ...

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SiFive claims ‘fastest licensable RISC-V processor IP’ for its 11+SPECInt2006/GHz core

SiFive has created what “is expected to be the fastest licensable RISC-V processor IP core in the market”, when it emerges in 2022. Building on the earlier Performance P550 processor, company engineering estimates are that it will have 40% more performance per clock cycle  – to 11+SPECInt2006/GHz – and it has architecture enhancements improve maximum ...

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Design rules for functional safety are explored at DAC

The role of EDA tools to automate manipulating, storing and exchanging data for functional safety systems was in the spotlight at DAC, as engineers wrestle with ways to improve interoperability, traceability and automation. The Accellera Functional Safety Working Group was created in December in 2019 and is dedicated to standardise across system, module, component and ...

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BMW signs supply deal with GloFo

BMW has signed a direct supply agreement with INOVA Semiconductors and GlobalFoundries. The agreement guarantees the BMW Group the supply of several million ICs a year. The deal follows a similar agreement struck last month between GloFo and Ford. BMW’s chips  will be used in the ISELED smart LED technology co-developed by BMW, which will be ...

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New Space gives way to Fast Space, Euroconsult reports

Euroconsult, a consultancy specialising in the space sector, has released its 2021 analysis and forecast of the satellite market, in terms of manufacturing and launch services. The report, entitled Satellites to be Built & Launched – 2021 Edition, includes headline points such as – on average – 1,700 satellites to be launched every year for ...

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TI claims smallest wideband 24-bit ADC

TI claims to have the smallest 24-bit wideband ADC that delivers leading-signal-measurement precision at wider bandwidths than competing ADCs. The ADS127L11, the newest product in TI’s portfolio of precision wideband ADCs, achieves ultra-precise data acquisition in a 50% smaller package, optimising power consumption, resolution and measurement bandwidth. The device offers wideband and low-latency filter options ...

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50Gbps PAM4 DSP for 5G fronthaul including O-RAN architectures

Marvell has announced a 50Gbps PAM4 DSP and TIA chipset for 5G fronthaul, which enables  integrated radio access networks (RAN) as well as Open (O-RAN) and virtualised (vRAN) architectures. The AtlasOne chipset supports carriers which want front haul solutions that scale beyond 25G. Carriers are upgrading radio capacity with wider bandwidths – up to 200 ...

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