Formnext: BCN3D adds 3d printing for metal prototypes

BCN3D of Barcelona has added metal printing to its line of 3D printers. Called the Metal Pack, it is aimed at the company’s Epsilon Series 3D printers (right). “This upgrade opens up a new range of applications, especially for spare parts, functional prototyping and tooling, and is mainly aimed at the pharmaceutical, food, automotive, aerospace ...

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Space Tech Expo: Earth observation from a CubeSat

Teledyne e2v and Centre Spatial Universitaire de Grenoble (CSUG) will be demonstrating an image analysis system for CubeSats at Space Tech Expo next week. Called QlevEr, the system is designed for 6U (100 x 200 x 300mm) Earth observation CubeSats, reducing link bandwidth by processing images into simplified binary maps before transmission to the ground. “There is ...

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NXP and Ford combine to connect cars

NXP and Ford are collaborating to enhance driver experiences, convenience and services across its fleet, including the 2021 Ford F-150 pickup, Mustang Mach-E and Bronco SUVs. Ford’s new fully networked vehicle architecture implements NXP’s vehicle networking processors and the i.MX 8 Series processors.NXP’s vehicle network processors provide in-vehicle networking and enable the gateway to deploy ...

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UK campaigns for seat on ITU

Today, tech minister Chris Philp (pictured) will kick off the UK’s campaign for a council seat at the International Telecommunication Union (ITU) – the UN telecoms agency which helps manage the world’s phone and satellite networks. The ITU allocates global spectrum and develops technical standards which enable everyday technologies such as mobile phones, television, vehicle ...

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Capacitive switch glues to rear of insulating panel

Schurter is aiming at easy-clean and sleek-looking surfaces with a ‘capacitive hidden switch’ that can be mounted behind thin non-conductive panel. Called the ‘CHS’ range, they come in three versions: non-illuminated, illuminated and sealed illuminated. They are mounted by gluing them to the back of the panel with 3M 468MP tape. CHS 1 circuit – output ...

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Samsung develops 14nm 16Gb LPDDR5X DRAM

 Samsung says it has developed the industry’s first 14nm based 16Gb Low Power Double Data Rate 5X (LPDDR5X) DRAM. The LPDDR5X DRAM will offer data processing speeds of up to 8.5Gbps, which are over 1.3 times faster than LPDDR5’s 6.4Gbps. It will use around 20% less power than LPDDR5 memory and will enable up to ...

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US satellite company Viasat buys Inmarsat for broadband and IoT

The US communications company Viasat is to acquire the London-based Inmarsat, with a view to building a global, hybrid space and terrestrial network, providing broadband and IoT services. The transaction is valued at $7.3 billion, with Viasat using $850 million in cash, approximately 46 million of its shares (valued at $3.1 billion) and the assumption ...

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Memory packaging market growing at 7% CAGR

The memory packaging market will grow to $19.8 billion in 2026 at a 7% CAGR 2020-26, says Yole Developpement, as the overall memory market grows at a CAGR20-26 of 9% (NAND) and 15% (DRAM), to reach $93 billion and $155 billion in 2026. Packaging for DRAM will account for 70% of the memory packaging segment in ...

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Diodes launches USB-C development kit

Diodes has launched a 130W USB Type-C power delivery (PD) 3.0 adapter evaluation and development kit using SuperGaN FETs from Transphorm. Capabilities include: High power peak efficiency: 93.5% High power factor: 0.90 over line over 60% load Ultra-low total harmonic distortion (THD): 18% over line over 60% load Low standby power: 43mW Lowest switch temperature: 75°C ...

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SSDs with PCIe 5.0 spec

Kioxia is now sampling select OEM customers with Enterprise and Data Center Standard Form Factor (EDSFF) E3.S SSDs designed with PCIe 5.0 technology. Features include: ● EDSFF E3.S form factor with capacities up to 7.68TB● Designed to the latest PCIe 5.0 specification and optimized for x2 PCIe lane performance● Using fewer PCIe lanes increases the ...

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