On Semi’s Bluetooth MCU scores high on low power

On Semi has introduced a Bluetooth wireless microcontroller, which has topped the charts on two of EEMBC’s benchmarks. Dubbed RSL15, it has Arm’s secured Cortex-M33 processor running at 48MHz, plus Bluetooth Low Energy 5.2 wireless. “RSL15 was certified by the Embedded Microprocessor Benchmark Consortium,” said On Semi. “The ULPMark CoreMark measures the energy efficiency of microcontrollers ...

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IoT eval kit has cellular, LoRa, Wi-Fi and Bluetooth, linked to cloud services

Murata and Pycom have created an IoT node evaluation kit to go along with Pycom’s cloud-based device management platform and a software development kit for managing devices, LPWAN networks and data feed “from commissioning through to deployment stages”, according to Murata. “Our collaboration with Murata offers a hardware and cloud platform that’s flexible through development, manufacture, integration, testing ...

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UK-Singapore digital trade deals signed

A series of agreements have been signed during the first Future Tech Forum in London to help create new digital trade opportunities, remove barriers to cross-border trade and reduce costs for businesses. Three Memoranda of Understanding (MoUs) were signed by UK Digital Secretary Nadine Dorries and her Singaporean counterpart, Minister for Communications and Information Josephine ...

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Sponsored Content – High Reliability Underfills for Automotive Applications

Exceptional Thermal Fatigue Resistance for Automotive Applications with ALPHA® HiTech® CU21-3240 Underfill. Using standalone SAC solder joints in BGA and CSP assemblies does not provide the level of thermal fatigue resistance required by automotive, aerospace, military and semiconductor manufacturers. To ensure that these assembled components are able to withstand long periods of exposure in harsh ...

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Dyson’s Metaverse

  Sir James Dyson has come up with a new approach to retailing where you can try out products via a VR demo using an Oculus Rift head-set. “We have been harnessing powerful virtual reality technologies to engineer new products in our labs for many years, now we are applying those same technologies to re-invent ...

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Power module packaging market on a 12.5% CAGR 2020-6

The power module market will reach $9.5 billion by 2026, with a 10.5% CAGR between 2020 and 2026, says Yole Develeloppement. The related packaging market will have a 12.5% CAGR during the same period, to about $3.5 billion. The cost of raw materials for power module packaging represents about 33% of the total power module ...

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U.S. Army turns to ICEYE for SAR mission imagery

ICEYE, the Finnish satellite imagery specialist, has entered into an R&D agreement with the U.S. Army to advance the Earth observation technology supporting army missions. Specifically, the cooperative research and development agreement (CRADA) is with the U.S. Army’s Space and Missile Defense Technical Center (SMDTC). They will explore together low-cost, on-orbit, synthetic-aperture radar (SAR) related ...

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Harwin adds female contact to Datamate

Building on the program where the different elements of its 4mm-pitch Datamate Mix-Tek connectors can be sourced separately, Harwin now offers a new female contact option to its customer base. Like all Mix-Tek coax contacts, the M80-310 is designed for data carrying, with support for frequencies reaching up to 6GHz. This latest contact can be ...

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