Sponsored Content: Getting ESD protection right for CAN-FD

Getting ESD protection right for CAN-FD NOVEMBER 30, 2020 By Lukas Droemer The expectations of travel and human interaction with vehicles is changing dramatically. As such, mega trends of increased connectivity, autonomous driving and electrification are pushing the evolution of automotive wiring harnesses and driving the growing demand for high-speed data transmission and bandwidth to ...

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OEMSecrets celebrates anniversary with improved BOM management

Our part-search-and-price-comparison engine, dubbed EW Compare, is powered by OEMSecrets. And the team behind the Bill of Materials tool and API are celebrating their 10th anniversary with improvements to both their website and search tools. They have launched their latest update by removing the login and opening up to the tool for free use by ...

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Printing silicon on bendy substrates

A method for manufacturing electronics which prints high-performance silicon directly onto flexible materials has been described by engineers from the University of Glasgow’s Bendable Electronics and Sensing Technologies (BEST) group. The current transfer printing process has a number of limitations which have made it challenging to create more large-scale, complex flexible devices. Precisely controlling critical variables like ...

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DRAM ASPs steadying

Q3 contract prices of PC DRAM are up 3-8% up on Q2 – less than the 25% increase of  Q2 on Q1, says TrendForce. The gradual lifting of COVID-related restrictions in Europe and the US is likely to lower the overall demand for notebook computers, thereby pulling down the overall demand for PC DRAM. TrendForce ...

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Farnell delivers INTERCONTEC

Farnell is now delivering INTERCONTEC circular connectors from TE Connectivity. The  INTERCONTEC plug-and-play connector concept simplifies modular machine design by offering a wide range of variants including power, signal or data – or all options combined – in one connector, providing a customised solution for specific applications. Applications include drive systems, robotics, automation, packaging, aerospace, ...

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Smaller FPGAs mean less power

Microchip has introduced a pair of programmable ICs with fewer resources to reduce power consumption. From its PolarFire brand, the parts are the MPF050T FPGA and MPFS025T SoC, both available in 11 x 11mm packaging. “We have reduced power consumption by up to 50% or more with the introduction of lower density offerings, while maintaining ...

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Active clamp fly-back controller for adapters up to 100W

Silanna Semiconductor has designed an active clamp fly-back controller to reduce the operational, no-load and stand-by power consumption chargers and adapters. Called SZ1131, it has an integrated clamp mosfet and a driver for an external fly-back mosfet. Efficiencies up to 95% across 90 – 265Vac input voltages and varying loads are possible, according to the ...

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ADC for electricity metering with resistive mains interface

For electricity metering, ADE9322B is a two-channel Σ-Δ ADC from Analog Devices. It current channel is designed to interface with a shunt resistor and its voltage channel interfaces with potential divider, both connected to the power rails, SPI and UART ports allow access to its internal registers. ‘mSure’ branding abounds. “mSure converts two analogue input ...

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Sondrel modelling flow cuts ASIC modelling time from months to days

It is important to model an SoC well in advance to avoid costly over design or insufficient performance and to create a hardware emulation on which representative end user applications can be run. Detailed architectural modelling provides reasonableestimates of the performance, power, memory resources, andthe NoC (Network on Chip) configuration that will be required along ...

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