Intel to put $3.5bn into packaging

Intel will invest $3.5 billion in packaging technology at its Rio Rancho, New Mexico plant. The plant employs about 1,800 workers and will be retooled to deliver Foveros packaging technology. Intel currently develops and produces its EMIB packaging technology, silicon photonics products, and Optane media at Rio Rancho. The current investment does not include Optane which utilises 3D ...

This story continues at Intel to put $3.5bn into packaging

Or just read more coverage at Electronics Weekly