Imec and ASML show EUV limits

Imec and ASML have demonstrated the ultimate single-exposure patterning capability of today’s 0.33NA NXE:3400 EUV lithography. Process optimizations have enabled the patterning of dense 28nm pitch line/spaces with an Inpria metal-oxide resist in one single exposure, relevant for high-volume manufacturing. For the first time, optical and e-beam inspections were correlated with electrical data to gain further ...

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binder M16 connectors aim at high pin count applications

binder is extending its M16 connector series, which offer environmental protection up to IP68, featuring mainly metal housings and a robust screw locking system. The combination of a high pin count with the compact size of nominally 18.5mm diameter and 60mm in length means M16 connectors offer an alternative to more expensive connector systems, says ...

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LoRa and GS1 exploring standardisation

The LoRa Alliance  and GS1 are to explore adding LoRaWAN networks as an available carrier technology to the GS1 standards. The goals are to provide greater efficiency and interoperability for supply chain and maintenance operations, strengthen inventory management, and simplify data exchanges between different systems and stakeholders. The initial collaboration addresses the requirements of the railway ...

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